Technical Library: component (Page 13 of 43)

3D Assembly Process a Look at Today and Tomorrow

Technical Library | 2016-04-21 14:10:55.0

The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Traditional printed circuit boards utilize the x/y plane and many miniaturization techniques apply to the x/y space savings, such as smaller components, finer pitches, and closer component to component distances.This paper will explore the evolution of 3D assembly techniques, starting from flexible circuit technology, cavity assembly, embedded technology, 3 dimensional surface mount assembly, etc.

Flex (Flextronics International)

Best Practices Reflow Profiling for Lead-Free SMT Assembly

Technical Library | 2013-06-05 23:14:44.0

The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process.

Indium Corporation

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Technical Library | 2014-10-23 18:10:10.0

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components

KYZEN Corporation

The X-Factor - How X-ray Technology is Improving the Electronics Assembly Industry

Technical Library | 2023-11-20 17:30:11.0

Summary for today 1. Electronic component inspection and failure analysis. 2. Component counting and material management. 3. Reverse engineering. 4. Counterfeit detection. 5. Real-time defect verification. 6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection. 7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI). 8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 9. Artificial Intelligence and x-ray inspection

Creative Electron Inc

Stencil Options for Printing Solder Paste for .3 Mm CSP's and 01005 Chip Components

Technical Library | 2023-07-25 16:42:54.0

Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.

Photo Stencil LLC

PCB Assembly With Obsolete Parts and Hard-To-Find Components

Technical Library | 2018-03-13 14:12:34.0

Many companies take their supply chain for granted until they need an obsolete part or a hard-to-find component. Then the importance of having resourceful contract manufacturing partners becomes an incredibly valuable asset.

Power Design Services

SMD Nomenclature - in Plain English

Technical Library | 2000-11-13 20:16:17.0

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included.

TopLine Dummy Components

Thermal Management of Electrolytic Capacitors

Technical Library | 1999-05-06 12:08:08.0

Input voltage capacitors are typically the parts that fail first in a high power circuit. Today's requirements for increasingly smaller packages is driving high component densities in power systems, as in all systems. As the package size...

Aavid Thermalloy, LLC

0201 and 01005 Adoption in Industry

Technical Library | 2011-02-03 17:58:46.0

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu

DfR Solutions

Backplane Architecture High-Level Design

Technical Library | 2011-03-16 20:09:11.0

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane

Lamsim Enterprises Inc.


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