Technical Library | 2012-04-09 14:08:18.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasi
Technical Library | 2023-09-23 22:25:12.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
Technical Library | 2023-09-23 22:29:02.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
Technical Library | 2007-04-05 13:48:50.0
Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints.
Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 2010-10-21 16:01:17.0
Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab
Technical Library | 2011-06-02 15:49:09.0
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa
Technical Library | 2011-08-11 20:06:48.0
(Proceedings of the World Congress on Engineering 2011) A Printed Circuit Board (PCB) consists of circuit with electronic components mounted on surface. There are three main steps involved in manufacturing process, where the inspection of PCB is necessar
Sant Longowal Institute of Engineering and Technology (SLIET)
Technical Library | 2012-03-22 20:40:01.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha
Technical Library | 2019-05-09 05:40:52.0
When the anti static ic tube is produced, it is empty at both ends. Therefore, before and after the electronic components are loaded into the plastic tube, the IC hoses need to be blocked at both ends. Generally, there are plastic nails and rubber stoppers.
.jpg)