Technical Library | 2016-12-15 17:18:28.0
Why embed the components? Embedded components have advantages over SMD because they are naturally screened from high frequency radio emissions (RFI or EMI). They can also be smaller than current SMD components. Both embedded and Mulpin components have these advantages, but Mulpin components have many more advantages and none of the disadvantages which can be seen below.
Technical Library | 2010-11-16 12:06:38.0
The Net Tie is a component type which allows for shorting together various nets in a design. The graphic for the symbol can be as simple as two component pins representing a virtual component between nets or as complex as mutipul pins (as many as desired)
Technical Library | 2020-01-02 12:16:02.0
A customer contacted the Helpline with the concern that parts being used in their assembly may possibly be counterfeit components. The counterfeiting of electronics components is a world-wide problem, and the threat today is even more evident than ever before. Any company, large or small, that manufactures assemblies using electronics components is equally susceptible to using counterfeit devices in their assemblies. In most cases, counterfeit components aren't discovered until after the component has already been placed on a printed circuit board (PCB), usually during first article electrical test. At this point, the only recourse is to debug the circuit to determine the faulty component and rework each PCB already in production to replace the faulty component. As one might easily surmise, this is a rather costly process; world-wide, counterfeit components account for over $15B loss in sales annually!
Technical Library | 2019-08-14 08:27:46.0
There are five forms of carrier tape sealing cracking. In particular, it is more important to seal products such as IC components (IC tape carriers) and lighter and thinner LED components (LED tape carriers).
Technical Library | 2000-11-13 20:48:41.0
Free 16 page reference guide includes lots of pictures. Quickly explains the most important features of SMD components.
Technical Library | 1999-05-09 12:51:38.0
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
Technical Library | 2001-04-24 10:38:38.0
Many PCB designers are interested in taking advantage of Multichip Modules, but are unfamiliar with the technology. While the design process is very much the same, MCM manufacturing processes vary dramatically. MCM routing requirements are dictated by the manufacturing process and types of components. Components mounted on MCM substrates are predominantly, if not exclusively, bare chips. As a result, the component body and I/O pins are no longer constrained to industry standard pin counts and form factors as are packaged components...
Technical Library | 2024-06-03 16:03:15.0
How Laser cutting can support medical electronics singulation of PCB and for medical components.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
