Technical Library | 2014-03-27 07:57:13.0
Data bus in computer terminology is a communication system that helps in transferring data between components within a computer, or between separate computers. Know more about data bus components and advancements in data bus technology by reading this article.
Technical Library | 2021-03-18 20:03:27.0
Much has been said and written about the accuracy of visual attribute inspections of potentially counterfeit components. The techniques and procedures being used to inspect counterfeit and reworked electronic components in the open marketplace can be quite effective in most cases.
Technical Library | 2021-12-31 06:09:47.0
The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2011-07-28 18:52:34.0
Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF
Technical Library | 2012-12-26 14:18:24.0
Passive components including resistors, capacitors, inductors, and circuit-protection devices compose the highest percentage of all devices that are populated on today’s PCB assemblies. However, the successful isolation and testing of these components during ICT is perhaps the most challenging and the least understood of all modern-day validation practices.
Technical Library | 2016-03-31 17:39:52.0
Electrical overstress causes damage to sensitive components, including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analyses sources of such noise, how it affects components and how to mitigate this problem.
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
Technical Library | 2022-03-02 21:52:34.0
In today's consumer-driven electronic marketplace many products have a limited useful life and component suppliers are moving to shorter product lifecycles. However, there are several industries that require semiconductor components to have a much longer lifecycle. In many cases application lifecycles within the Industrial, Automotive, Medical, Aerospace and Defense sectors may extend up to 30 years or more. As a result, an ongoing component supply becomes critical to sustaining these applications throughout their useful lifecycle. For this reason, it is often a requirement that semiconductor components be stored for extended periods of time after production ends.
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