Technical Library: component (Page 10 of 43)

1CLICKSMT Odd form Component inserting System -- Solution for security products assembly

Technical Library | 2020-04-29 03:25:11.0

1CLICKSMT has recently installed a odd form component inserting and wave soldering line for a security products manufacturer.

1 CLICK SMT TECHNOLOGY CO., Limited

Guidelines for the Long-Term Storage of Components, Subasseemblies and Devuces

Technical Library | 2024-06-19 14:23:36.0

These guidelines on long-term storage are intended to help develop a supply strategy for components which need to be warehoused, processed and used beyond ...

ZVEI - German Electro and Digital Industry Association

Solder Preform Basics

Technical Library | 2009-12-14 20:27:54.0

Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering.

Indium Corporation

Realization of a New Concept for Power Chip Embedding

Technical Library | 2020-10-18 19:31:27.0

Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top side are mounted in hand held devices. Smartphones have been the enablers for this new technology using the capabilities of embedded components. With this technological background another business field became interesting for embedded components – the embedded power electronics. The roadmap of the automotive industry shows a clear demand for miniaturized power electronic applications. Drivers are the regulations for the international fleet emissions which are focusing on three major trends.

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Lead-free Rework Process For Chip Scale Packages

Technical Library | 2007-03-28 10:18:33.0

Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.

Universal Instruments Corporation

Avoidance of Ceramic-Substrate-Based LED Chip Cracking Induced by PCB Bending or Flexing

Technical Library | 2022-09-25 20:18:33.0

Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.

Cree Lighting

RULES FOR WORKING WITH 0201s AND OTHER SMALL PARTS

Technical Library | 2023-05-02 18:54:30.0

Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) – that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process.

Advanced Assembly, LLC.

Basics of Industrial Control System and the Use of PLC

Technical Library | 2021-11-26 01:18:30.0

The components of industrial control system (ICS) can be roughly divided into two categories according to their location: control center equipment and remote site equipment.

OKmarts Industrial Parts Mall

SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions

Technical Library | 2011-07-07 03:37:13.0

The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components

KEMET Electronics Corporation

Imbedded Component/Die Technology (IC/DT®)

Technical Library | 2009-02-26 03:25:09.0

STI has developed a patented1 packaging technology coined Imbedded Component/Die Technology (IC/DT®) to integrate multiple subsystems within an electronics assembly into a single, advanced, high-density assembly. Imbedded Component/Die Technology (IC/DT®) enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density CCAs through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management

STI Electronics


component searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Easily dispense fine pitch components with ±25µm positioning accuracy.
SMT feeders

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
SMT feeders

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Equipment Auction Automotive Electronics Supplier - Closure of Tier-One SMT Dvision: (10) ASM & Universal SMT Lines & Feeders Equipment as-new-as 2019! Dek | Koh Young | Speedline | Vitronics | Viscom

Best Reflow Oven