Technical Library | 2023-08-14 09:06:53.0
In the operation of SMT mounter, the process and integrity of the nozzle of the mounter will have a significant impact on the performance of the machine. As one of the important components of the SMT machine, it is necessary for us to carry out daily maintenance and upkeep of the SMT nozzle. To ensure that the suction nozzle of the SMT machine is intact before operation, how should we do a good job of maintaining the suction nozzle of the SMT machine during normal use? KINGSUN technical team analysis operation has the following main points: 1.Wipe the surface of the SMT nozzle with a dust-free cloth. 2.The small aperture nozzle can be passed through with a thin steel wire and then blown with an air gun. 3.The surface of the nozzle should not be soaked with corrosive solution such as alcohol, as this may cause the surface to fall off. 4.HOLDER should use a cotton swab to wipe the cavity and not damage the filter screen. 5.Regular addition of special grease to HOLDER claws. 6.According to production, it is best to regularly maintain and do other maintenance regularly. (* Suitable for Yamaha SMT machine nozzles , JUKI SMT machine nozzles, Samsung SMT machine nozzles, Panasonic SMT machine nozzles, Fuji SMT machine nozzles, Siemens SMT machine nozzles etc.) Regarding the SMT machine nozzle daily maintenance operation instructions, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com , thanks.
Technical Library | 2019-05-06 23:04:05.0
The temperature and humidity test chamber simulate the temperature and humidity, so there are a lot of things customers shoud notice in the process of use, although there is detailed instruction when purchasing the equipment. But some users just know how the device works and start using it. This is very easy to cause problems in the use of the equipment, so Symor intends to describe the safety details during the use of temperature and humidity chamber. 1. Before the test, determine if the sample contains flammable and explosive substances to avoid combustion or explosion during the test. Of course, also make sure there is no flammable and explosive material around the test equipment, otherwise it may cause fire and other accidents. 2, Do not open the chamber door to operate during the experiment, or the gas in the studio may cause the operator to burn and so on. 3. At the end of the test or at the time of regular cleaning of the test chamber, power off the equipment to avoid electrocution accidents. Also, when cutting off the equipment power, pull the power cord to pull out the plug, otherwise it may lead to a rupture of the power cord and so on. You can contact manufacturers if there are some places you donnot understand, do not dismantle and repair the temperature and humidity test chamber without authorization, otherwise it may lead to more serious problems.
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Technical Library | 2019-05-23 21:56:56.0
Automatic on-line shoe sole spraying system: automatic shoe sole spraying system, simple and convenient operation, using 3D vision positioning system. Automatic recognition and automatic generation of spraying trajectory. Robot non-contact spraying gun is used to complete the process of shoe sole spraying with maturity, stability, high speed and high precision along the predetermined trajectory. The automatic generation of spraying trajectory is the realization of shoe sole spraying technology. Shoe sole spraying characteristics: 1.Positioning System: 3D Visual Positioning 2.Components: Intelligent Robot, Laser Scanner, Industrial Computer, Gum Spraying System, Conveyor Belt, Electrical Control System, etc. 3.Spraying time: slightly different according to shoe size and spraying time Fully automatic sole spraying advantages: 1. Simple application: suitable for soles of different specifications, models and sizes 2. Faster speed: 6-8 seconds to complete sole scanning and spraying, superior to similar products at home and abroad. 3. Quality stability: gum spraying trajectory is scheduled, gum dosage is fixed, gum spraying quality is greatly improved. 4. High cost performance: the same performance, the price is only 1/3 of the same type of equipment of European brand. 5. Reduce wear and tear: glue is fully utilized and not wasted, reducing human contact with glue. Intelligent operation advantage manual only need general operation can be automated workshop, mechanical arm automatic spraying glue, accurate spraying, reduce glue waste. Environmental protection effect of long-term close contact with glue seriously affects human health and mechanical work, glue does not directly contact, do not harm the human body. Fully automatic spraying, shoe sole adhesion process for automatic spraying machine, will not cause great challenges! With the deepening of personalized shoemaking, higher requirements have been put forward for the spraying technology in shoemaking process. The method of creating spraying trajectory must be adapted to shoes of different sizes and styles. The automatic generation of spraying trajectory is one of the key technologies to realize the automation of shoe sole spraying process. The method of off-line programming and real-time generation of spraying trajectory for robots based on the three-dimensional CAD model of sole and the data of sole. A new method of generating spray trajectory by scanning the sole of shoe upper with linear structured light sensor is presented. The feasibility of the method is verified by industrial robots. Aiming at the need of generating shoe sole spray rubber trajectory based on line structured light, the format standard of IGES file of three-dimensional model of shoe sole was tested. The shoe sole contour line and the shoe sole surface were extracted, and then the offset curve of the shoe sole contour line on the shoe sole surface was calculated to obtain the spray rubber trajectory. Three-dimensional profilometer is to use structured light to obtain sole information, effectively improve the automatic shoemaking spraying process, which will help to improve the efficiency of shoemaking, improve the quality of footwear products, and promote the development of personalized shoemaking.
| 1 |
