Technical Library: component stacking (Page 1 of 1)

The Challenges Of Package On Package (Pop) Devices During Assembly And Inspection

Technical Library | 2021-12-16 01:33:11.0

Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.

Electronic Presentation Services

Solder Joint Encapsulant Adhesive POP Assembly Solution

Technical Library | 2014-05-12 09:24:11.0

With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.

YINCAE Advanced Materials, LLC.

Solder Joint Encapsulant Adhesive Pop TMV High Reliability And Low Cost Assembly Solution

Technical Library | 2014-06-02 11:03:45.0

With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.

YINCAE Advanced Materials, LLC.

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

Technical Library | 2011-10-06 13:59:04.0

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.

Cadence Design Systems, Inc.

Miniaturization with Help of Reduced Component to Component Spacing

Technical Library | 2015-03-12 18:26:16.0

Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are many ways to increase the packaging density and a few examples would be to stack them with Package on Package (PoP), fine pitch CSP's, 01005 and last but not least reduced component to component spacing for active and passive components (...)This paper will discuss different layouts, assembly and material selections to reduce component to component spacing down to 100-125um (4-5mil) from today’s mainstream of 150-200um (6-8mil) component to component spacing.

Flex (Flextronics International)

Assembly and Rework of Lead Free Package on Package Technology

Technical Library | 2024-01-16 22:29:59.0

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.

TT Electronics

Reliability Testing For Microvias In Printed Wire Boards

Technical Library | 2021-01-21 02:04:27.0

Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour.

PWB Interconnect Solutions Inc.

  1  

component stacking searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Smt Feeder repair service centers in Europe, North, South America
SMT spare parts - Qinyi Electronics

Wave Soldering 101 Training Course
High Throughput Reflow Oven

High Precision Fluid Dispensers
Formic Reflow Soldering

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
AI Data Center Hardware Manufacturing

World's Best Reflow Oven Customizable for Unique Applications
PCB separator

Internet marketing services for manufacturing companies