Technical Library: component tolerance (Page 1 of 1)

Beat the Heat in Notebooks With Software

Technical Library | 1999-05-06 10:46:06.0

Pentium-class portables present significant packaging problems. The heat generated inside a notebook not only reduces microprocessor reliability, but the reliability of peripheries such as hard drives and video chips. Although the processor is the primary heat-generating source, it isn’t always the component least tolerant of temperature...

Aavid Thermalloy, LLC

Water Soluble Solder Paste, Wet Behind the Ears or Wave of the Future

Technical Library | 2017-03-22 20:58:08.0

Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies.

FCT ASSEMBLY, INC.

Achieving Tight Tolerances

Technical Library | 2024-05-31 19:29:15.0

A tight tolerance machine isn't necessarily a specific machine type. Rather, it's any machine capable of producing parts with precision tolerances. This means minimal variation in the final dimensions of the part. These cutting-edge tools are meticulously engineered to achieve exceptionally precise measurements within minuscule margins. This is accomplished with CNC, or computer numerical control, a manufacturing method that automates the movement of a machine and optimizes for precision. With technology and advanced techniques, these machines ensure that every component meets exact specifications, guaranteeing unparalleled accuracy in manufacturing processes.

A-Laser, Inc.

How to protect your PCB from moisture related damage?

Technical Library | 2019-04-07 22:47:46.0

How to protect your PCB from moisture related damage? J-STD-033 put forward stricter regulation on the MSD exposure environment,when the exposure time exceed the tolerated,the moisture will penetrate into electronics,Moreover, the newest RoHS regulation will rise soldering temperature,the sudden high temperature will lead to expansion and cracking on electronic components. In order to decrease the moisture defect on PCB for the manufacturers in China,Climatest Symor® begin to concentrated on electronic dry cabinet R&D since early 1990s,we specialize in handling temperature and humidity for 20 years,and we provide best solution for PCB storage.

Symor Instrument Equipment Co.,Ltd

Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards

Technical Library | 2019-09-11 23:33:04.0

There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.

LPKF Laser & Electronics

Design and Integration of aWireless Stretchable Multimodal Sensor Network in a Composite Wing

Technical Library | 2020-10-08 00:55:22.0

This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor "islands" connected by interconnecting "serpentines." A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge(SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c)configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication.

Stanford University

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