Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2023-11-07 09:36:38.0
How to Choose the Right PCB Coating Machine Line Selecting the ideal equipment for your PCB coating line can be a complex task. In this article, we will guide you through the critical components of a standard PCB coating machine line and their solutions to common challenges. We'll delve into the line's composition, including the elevator, transfer station, coating machine, inspection station, curing oven, and their interconnectedness through a return conveyor. Let's explore each element and understand its role. Components of a PCB Coating Machine Line: Elevator: The PCB coating process starts with an elevator, efficiently transporting PCB boards to the next stage. Transfer Station: After the elevator, boards are conveyed to a transfer station, preparing them for the coating process. Coating Machine: The heart of the PCB coating line is the coating machine. We offer a range of coating machines, including I.C.T-T550, I.C.T-T550U, I.C.T-T600, and I.C.T-T650. Inspection Conveyor: Following the coating process, the boards move to an inspection station. The second transfer station is equipped with LED lights and a blue glass cover, enabling operators to closely inspect the coating quality. This feature is vital for ensuring consistent, dust-free coatings. Curing Oven: For UV-curable adhesives, we provide a UV curing oven to effectively solidify the adhesive. Return Conveyor: Beneath the entire line runs a return conveyor, connected to the elevator. This conveyor system efficiently returns PCBs from the last elevator to the first one, reducing manual handling and streamlining operations. The Advantages of the PCB Coating Line Design: 1. Easy Accessibility: The operator's station is strategically located beside the coating machine, ensuring easy access for setup and adjustments. 2. Enhanced Efficiency: The integrated return conveyor eliminates the need for manual transport, optimizing workflow. 3. Quality Control: The inspection station with the blue glass cover enables operators to inspect coatings for quality and cleanliness. 4. Dust Prevention: The blue glass cover also serves as a barrier to prevent dust contamination on freshly coated PCBs. Selecting the right PCB coating machine line is essential for achieving quality and efficiency in your operations. Our meticulously designed equipment line, along with its well-engineered components, can help you attain superior results. If you have further questions or need assistance in choosing the best solution for your specific requirements, please do not hesitate to contact us. We are committed to providing solutions that meet your needs and exceed your expectations.
Technical Library | 2021-01-13 21:34:29.0
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Technical Library | 2021-02-25 14:19:00.0
This study proposes a new design of lightweight and cost-e#14;cient composite materials for the aeronautic industry utilizing recycled fresh scrap rubber, epoxy resin, and graphene nanoplatelets (GnPs). After manufacturing the composites, their bending strength and fracture characteristics were investigated by three-point bending (3PB) tests. Halpin–Tsai homogenization adapted to composites containing GnPs was used to estimate the moduli of the composites, and satisfactory agreement with the 3PB test results was observed.
Technical Library | 2022-03-21 19:00:07.0
X-ray fluorescence (XRF): a non-destructive analytical technique used to determine the chemical composition of materials XRF occurs when a fluorescent (or secondary) X-ray is emitted from a sample that is being excited by a primary X-ray source. Because this fluorescence is unique to the elemental composition of the sample, XRF is an excellent technology for qualitative and quantitative analysis of the material composition. XRF spectrometry has a broad range of applications in industry, which we will discuss later in this ebook.
Technical Library | 2010-09-23 20:23:37.0
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thi
Technical Library | 2021-12-29 19:37:20.0
The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests.
Technical Library | 2020-10-14 14:49:14.0
In this study, the modification of an epoxy matrix with different amounts of cube-like and rod-like CaCO3 nanoparticles was investigated. The effects of variations in the morphology of CaCO3 on the mechanical properties and thermal stability of the CaCO3/epoxy composites were studied. The rod-like CaCO3/epoxy composites (EP-rod) showed a higher degradation temperature (4.5 _C) than neat epoxy. The results showed that the mechanical properties, such as the flexural strength, flexural modulus, and fracture toughness of the epoxy composites with CaCO3 were enhanced by the addition of cube-like and rod-like CaCO3 nanoparticles. Moreover, the mechanical properties of the composites were enhanced by increasing the amount of CaCO3 added but decreased when the filler content reached 2%. The fracture toughness Kic and fracture energy release rate Gic of cube-like and rod-like CaCO3/epoxy composites (0.85/0.74 MPa m1/2 and 318.7/229.5 J m
Technical Library | 2022-01-26 15:26:56.0
In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity.
