Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2020-03-12 14:14:07.0
IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success
Technical Library | 2012-06-07 21:44:28.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. IPC-175x Intent: To establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain.
Technical Library | 2012-07-05 06:10:59.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. A new innovation for increasing quality & productivity of wave soldering machines.
Technical Library | 2012-05-31 18:01:31.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such
Technical Library | 2012-07-19 21:24:02.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high
Technical Library | 2013-05-02 12:45:25.0
Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing. Discussion of requirements for understanding the technology of these applications in order to capitalize on them... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2012-05-17 21:53:39.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Companies that have initiated internal resources to obtain compliance data have realized that collecting, and more importantly, maintaining the currency of that data requires more
Technical Library | 2012-08-23 21:06:35.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res
Technical Library | 2012-09-06 18:19:37.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pad Cratering opens circuits. This occurs when the resin crack (fracture) migrates through a copper trace or via. This happens at assembly, in service or during handling. When com
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