Technical Library | 2013-03-07 14:36:33.0
No one can deny that organizations across the country have been greatly affected by the decline in the economy. The manufacturing industry is no different. Even now as things seem to be looking up, companies are continually looking to cut costs and increase efficiencies. In addition, these companies must remain compliant with the strict quality and safety standards of the industry, adding even more pressure. Because of this, innovative, automated and easy to use products are needed more than ever before to help companies achieve their goals.
Technical Library | 2014-03-27 14:32:24.0
The surface finish you select will have a large influence on quality, reliability and cost. It is a complex decision that impacts many areas of the business. Select a finish that optimal for the business (and not just one function). Know that there are engineering tricks to improve on weak areas of each finish. Stay current in this field because new developments continue to be made.
Technical Library | 2017-11-01 17:06:38.0
Over fifteen years has passed since North America and Europe ceased being the center of worldwide PCB fabrication, and were supplanted by a Far East market with low cost labor, more relaxed environmental requirements, and strong government support. In just a few short years, the superior cost advantages of this new dynamic put volume PCB production in the West out of business, aside for the military and specialty technology applications contained in the few shops that continue to exist today.Recently, however, the conditions which created the current equilibrium appear to be shifting again. In this new dynamic, automation, innovative green wastewater technologies, and next generation process equipment innovations have combined to make new factories capable of achieving rapid ROI for PCB fabrication almost anywhere. This paper means to illustrate this new dynamic, and provide case study examples from the new greenfield installation at the company captive facility in New Hampshire.
Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 2010-11-18 19:19:50.0
In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is
Technical Library | 2015-04-03 20:02:31.0
Understanding your process and how to minimize defects has always been important. Nowadays, its importance is increasing with the complexity of products and the customers demand for higher quality. Quality Management Solutions (QMS) that integrate real-time test and inspection results with engineering and production data, can allow the optimization of the entire manufacturing process. We will describe the cost and time benefits of a QMS system when integrated with engineering data and manufacturing processes. We will use real examples that can be derived from integrating this data. This paper also discusses the aspects of Quality Management Software that enables electronic manufacturers to efficiently deliver products while achieving higher quality, reduce manufacturing costs and cutting repair time. Key words: Quality Management Software, ICT, Repair workstations, First Pass Yield, Pareto analysis, Flying Probe, QMS.
Technical Library | 2016-01-12 11:07:56.0
With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process.
Technical Library | 2016-02-04 19:11:47.0
In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.
Technical Library | 2017-01-19 16:58:47.0
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.Rigid-Flex circuit boards require additional cutting and lamination stages, and more exotic materials in manufacturing and therefore the cost of re-spins and failures are very much higher than traditional rigid boards. To reduce the risk and costs associated with rigid-flex design and prototyping, it is desirable to model the flexible parts of the circuit in 3D CAD to ensure correct form and fit. In addition it is necessary to provide absolutely clear documentation for manufacturing to the fabrication and assembly houses.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
