Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2023-09-16 07:10:47.0
LED high speed pick and place machines are a complex and specialized piece of equipment. In this quick guide, we will cover the basics of how these machines work, as well as some of the factors to consider when choosing one.
Technical Library | 2019-09-03 09:52:53.0
The cover tape and the carrier tape are two different products, and many people cannot distinguish the difference between the cover tape and the carrier tape.
Technical Library | 2019-08-14 08:27:46.0
There are five forms of carrier tape sealing cracking. In particular, it is more important to seal products such as IC components (IC tape carriers) and lighter and thinner LED components (LED tape carriers).
Technical Library | 2013-05-30 17:33:26.0
This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions
Technical Library | 1999-05-07 10:16:31.0
This paper will describe practical aspects of a redundancy implementation on a high-volume cache memory product. Topics covered include various aspects of redundancy from a design and product engineering perspective; and present test development methods for future product implementations.
Technical Library | 2021-12-21 23:11:50.0
This paper cover the following points: - Objective 01: Preprocessing, - Introduction, - Objective 02: Automated FE Scripting, - Objective 03: Postprocessing, Reliability Analysis of PTHs, - Objective 03: Postprocessing, Manufacturability of Microvias
Technical Library | 2018-08-01 11:25:59.0
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essential to have a good 'Design for Test' (DFT) to ensure a robust structural test. (...)During the course of the DFT review, can we realize a good test strategy for the PCBA. How can the test strategy of the PCBA be partitioned as to what portions of the design can be covered structurally and what is covered functionally, in a way that provides best diagnostics to discover faults
Technical Library | 2015-04-02 20:12:58.0
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. According to the iNEMI 2013 placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 um by 2023.This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape. The correlation of deposit diameter and positioning deviation as a function of piezo actuation profile shows that positioning error for deposits increase almost monotonically with decreasing droplet volume irrespective of the piezo-actuation profile. The trends for shape and satellite levels are not as clear and demand further study.
Technical Library | 2003-05-05 07:36:58.0
The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization.
