Technical Library | 2023-11-25 07:46:13.0
In the dynamic realm of Surface Mount Technology (SMT), where efficiency and precision are paramount, I.C.T, a renowned SMT equipment manufacturer, proudly unveils its latest innovation – the I.C.T-910 Automatic IC Programming System. Crafted to cater to the intricate demands of SMD chip programming, this cutting-edge device vows to redefine your programming experience and elevate production capabilities. Programming system.png The Power of IC Programming System: As a beacon of excellence in IC Programming Systems, the I.C.T-910 seamlessly integrates advanced technology with user-friendly features. This system empowers manufacturers in the SMT industry, offering versatility in programming needs by accommodating a wide range of SMD chips. Precision Programming: The I.C.T-910 boasts unparalleled precision in programming SMD chips, ensuring accuracy in every generated code. In the SMT industry, where even the slightest error can lead to setbacks, this precision is indispensable. Efficiency Redefined: Accelerate your production timelines with the I.C.T-910's efficient programming capabilities. Engineered to optimize workflows, this system ensures rapid programming without compromising quality, recognizing that time is money in the SMT industry. User-Friendly Interface: Navigating the complexities of IC programming is simplified with the I.C.T-910's intuitive user interface. Operators, even without extensive programming expertise, can harness the system's power, minimizing the learning curve and maximizing productivity. Compatibility and Adaptability: The I.C.T-910 breaks free from limitations, supporting a wide array of SMD chip models. It is a versatile solution for diverse programming requirements, allowing you to stay ahead of technological advancements. Why Choose I.C.T-910 IC Programming System? 8 sets of 32-64sit burners Nozzle: 4pcs Camera: 2pcs (Component camera + Marking camera) UPH: 2000-3000PCS/H Package type: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. Compatibility: Adapters provided based on customer products. Simple operation interface: Modular and layered interface with pictures and texts for easy operation. System upgrade: Free software upgrade service. Reliability: Trust in the I.C.T-910, a programming system that prioritizes reliability. Rigorous testing ensures consistent and dependable performance, reducing the risk of programming errors and downtime. Elevate Your Competitiveness: Incorporate the I.C.T-910 into your production line to elevate competitiveness in the market. Stay ahead with a programming system designed to meet the demands of the fast-paced SMT industry. Embrace the Future with I.C.T-910: In a landscape where precision, efficiency, and adaptability are non-negotiable, the I.C.T-910 Automatic IC Programming System emerges as the game-changer for SMT manufacturers. Revolutionize your programming processes, enhance productivity, and future-proof your operations with the I.C.T-910. Choose I.C.T-910 and stay ahead in the SMT industry, ushering in the next era of IC programming excellence.
Technical Library | 2000-11-13 20:45:03.0
Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips.
Technical Library | 2007-04-05 13:48:50.0
Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints.
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
Technical Library | 2014-04-11 16:03:15.0
In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for use in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable.
Technical Library | 2016-01-12 11:09:47.0
In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for used in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable.
Technical Library | 2013-08-14 14:06:48.0
This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.
Technical Library | 2013-03-04 16:51:00.0
Chip-scale (or chip-size) packages are rapidly becoming an important element in electronics due to their size, performance, and cost advantages [Hou, 1998]. The Chip Scale Package (CSP) is becoming a key semiconductor package type, particularly for consumer products. Due to their relatively smaller size, new challenges are presented in the rework and repair of CSPs. (...) The specific focus of this paper is the removal process for rework of CSPs and the site scavenging methods required to properly prepare the circuit board for a new component. Process factors such as the heating, fluxing and, atmosphere are discussed.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
