Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Technical Library | 2015-04-03 20:02:31.0
Understanding your process and how to minimize defects has always been important. Nowadays, its importance is increasing with the complexity of products and the customers demand for higher quality. Quality Management Solutions (QMS) that integrate real-time test and inspection results with engineering and production data, can allow the optimization of the entire manufacturing process. We will describe the cost and time benefits of a QMS system when integrated with engineering data and manufacturing processes. We will use real examples that can be derived from integrating this data. This paper also discusses the aspects of Quality Management Software that enables electronic manufacturers to efficiently deliver products while achieving higher quality, reduce manufacturing costs and cutting repair time. Key words: Quality Management Software, ICT, Repair workstations, First Pass Yield, Pareto analysis, Flying Probe, QMS.
Technical Library | 2016-01-12 11:07:56.0
With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process.
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
Technical Library | 2016-08-11 01:21:34.0
Be it a residential building, hospital, shopping mall, hotel, school, educational institution or any kind of a building, the security of the building is a prime facet to get a complete building solution. This also includes protecting the building, its assent and the human life from the airborne toxic industrial chemical, radiological and biological attacks or any accidental release apart from fire, water, earthquake and other security concerns. For these high value security solutions, the upgraded technology for the building safety system is now a top priority, especially in the commercial building sector and residential constructions. To introduce a completely new concept and a unique solution, it is necessary to focus on the dynamic electronic design and manufacturing solution in consultation with the custom PCB experts.
Technical Library | 2016-08-17 01:24:36.0
To stake a claim in upcoming new technologies and increasing improved customer experience, it is now becoming a central point of consideration to bring out the new classy vehicle design, car manufacturing techniques, testing system in the global market. The current vehicle manufacturer’s also aim to maintain equilibrium between deep capital investment and long product cycle to make the car model a success story. With this, the type of printed circuit board to be used in the vehicle is decided with focusing more on the type of material used in the vehicle and the level of electronic manufacturing and design solution needed in the vehicle production. To go into the roots of the automotive industry, it is equally important to get insights into the PCB used in vehicles and the new innovations brought forward by researchers to create a dream vehicle of the series. The below paragraph drives you to the types of PCB used in the automotive sector.
Technical Library | 2016-09-29 17:23:51.0
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact, when evaluating solutions for lower volume and higher mix products typically found in the medical, industrial and public safety segments of the OEM market, IL & DL costs are only one subset of the total cost to land the product and service the ultimate customer. In this paper, there will be examination of what actual cost components should be included in a landed cost analysis, the soft costs that an OEM should consider to deliver outstanding performance in quality, logistics and delivery management of the supply chain solution. A detailed comparison using a 'case study' will be presented to demonstrate a total landed cost option versus one that is focused on IL/DL cost.
Technical Library | 2018-02-28 22:28:30.0
Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium
Technical Library | 2019-01-10 10:24:47.0
We notice that the quantities of material that are to be dosed are becoming more and more divergent. In addition to large media volumes, small and very small quantities are also increasingly coming into focus. For example autonomous driving: These vehicles already produce an immense amount of data today. When potting the associated sensors, cameras, and ECUs, it is important to ensure a precise and repeatable media application – even with volumes of only 0.03 ml. In contrast, when high-voltage batteries for electric cars are potted, 5 to 10 litres of heat-conducting paste are required per vehicle – and the trend is rising. Optical bonding used in display production, on the other hand, is in the medium volume range. The challenge now is to cover the entire volume spectrum reliably and in compliance with the required cycle times. This is remedied by a modular system of scalable modules, which offers the customer the necessary flexibility and enables him to plan a system according to his needs.
Technical Library | 2020-01-02 12:16:02.0
A customer contacted the Helpline with the concern that parts being used in their assembly may possibly be counterfeit components. The counterfeiting of electronics components is a world-wide problem, and the threat today is even more evident than ever before. Any company, large or small, that manufactures assemblies using electronics components is equally susceptible to using counterfeit devices in their assemblies. In most cases, counterfeit components aren't discovered until after the component has already been placed on a printed circuit board (PCB), usually during first article electrical test. At this point, the only recourse is to debug the circuit to determine the faulty component and rework each PCB already in production to replace the faulty component. As one might easily surmise, this is a rather costly process; world-wide, counterfeit components account for over $15B loss in sales annually!
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