Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2022-10-31 08:40:27.0
Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
Technical Library | 2007-11-01 17:16:07.0
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,
Technical Library | 2020-04-16 05:52:45.0
Based on the dual pot, we developed an independent dual z-axis control dual pot for FLEX-i2! There are 5 operation modes available with the independent dual Z axis: only solder pot1, only solder pot2, first solder pot 1 then solder pot2, first solder pot2 then solder pot1, solder pot1 and solder pot2 together. In specific applications, solder pot1 can be selected with large nozzle soldering heat-absorbing large parts, solder pot2 use small nozzle soldering heat-absorbing small parts, so as to achieve both soldering effect and productivity. Also can use same nozzle, dual axis simultaneously solder two same plate to increase productivity. To get the maximum flexibility and productivity! FLEX-i2 is a compact in line selective soldering machine, equipped with high precision servo control system, jet valve, live-on camera, upper preheating etc, which can provide a high flexibility and efficiency soldering process. The maximum soldering size can reach 420mm*490mm!
Technical Library | 2022-10-31 08:39:26.0
Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days
Technical Library | 2022-10-31 09:21:53.0
Minimum Order Quantity: 1/pcs Price: Negotiable,EXW Price Packaging Details: High quality carton packaging Delivery Time: 1-2 work days Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram Supply Ability: 1000pcs monthly, delivery time 1-2 days
Technical Library | 2014-02-27 15:30:20.0
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices
Technical Library | 2023-11-20 17:30:11.0
Summary for today 1. Electronic component inspection and failure analysis. 2. Component counting and material management. 3. Reverse engineering. 4. Counterfeit detection. 5. Real-time defect verification. 6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection. 7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI). 8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 9. Artificial Intelligence and x-ray inspection
Technical Library | 2007-10-02 22:09:50.0
The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share of the electronics market driven by Department of Defense (DoD) applications has created a niche market for RF qualified devices. The DoD, with its emphasis on COTS (Commercial Off The Shelf) and "Open" systems, is beginning to become more interested in using commercially oriented RF devices for military applications as a means to leverage the volumes and innovations of the commercial world.
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