Technical Library: d2pak heatsink design (Page 1 of 1)

CORRELATION BETWEEN CALCULATION AND PRACTICE FOR SIMPLE TOP-TO-BOTTOM PCB HEAT DISSIPATION USING TIM & VIAS

Technical Library | 2024-07-24 01:27:58.0

A study of the Thermo Design PCB Indicates The better the performance of the heatsink (=low Rth), the more influence the TIMs have  The thickness of a TIM is often more critical than the thermal conductivity of the material  The thermal resistance of the surface between the materials are most critical  Better use many small vias than a few big vias!  Plated or filled vias are very expensive to get, better try to stay with standard!

Würth Elektronik GmbH & Co. KG

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