Technical Library | 1999-05-06 12:11:42.0
The newest workstations and servers, targeting computationally-intensive applications and large-scale database management, use 64-bit microprocessors and provide the next generation of computing power.
Technical Library | 2019-03-25 12:45:56.0
Work instructions are time consuming to generate for engineers, often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail, with varying guidelines, for multiple stations, operators and lines. Minor component, station or process changes – down to the modification of an individual BOM component – can cause headaches when attempting to maintain consistency across multiple work instructions that are touched by the change.The solution presented here improves efficiency and saves engineering time by making use of a database driven approach. Manufacturing details, component information, process guidelines, annotations, machine-specific data, and more can be stored in one central database. Any information stored in this single repository can then be modified quickly in one location and automatically propagate seamlessly throughout multiple work instructions. These can be instantly printed out or displayed on screens at appropriately affected stations with the simple click of a button, as opposed to regenerating from scratch, or going in and reviewing many documents to find and update with the change.
Technical Library | 2017-12-13 23:58:32.0
In a global market, it is often difficult to determine the best PCB suppliers for your technology needs, while also a chieving the lowest costs for your products. Considering each PCB supplier has their own niche in t erms of equipment, process, and performance, uniform test data from the IPC -9151D Process Capability, Quality, and Relative Reliability (PCQR 2 ) Benchmark Test Standard can help find the right source for the board based on its specific technology requirements. By using a data-based approach to vendor selection, this can remove the subjective nature of sourcing, reduce the need for PCB process experts to map suppliers into technologies, and eliminate irrational sourcing decisions.
Technical Library | 2019-03-15 16:26:50.0
While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation and networking, there is one aspect of production that remains stubbornly unaffected. Massive databases track everything from orders, to inventory, to personnel. CAD systems allow for interactive and dynamic 3D rendering and testing, digital troubleshooting, and simulation and analysis prior to mass production. Yet, with all of this computational power and all of this networking capability, one element of production has remained thoroughly and firmly planted in the past. Nearly all manufacturing or assembly procedures are created, deployed, and stored using methodologies derived from a set of assumptions that ceased to be relevant fifty years ago. This set of assumptions, referred to below as the “Paper Paradigm” has been, and continues as the dominant paradigm for manufacturing procedures to this day. It is time for a new paradigm, one that accounts for the vastly different technological landscape of this era, one that provides a simple, efficient interface, deep traceability, and dynamic response to rapidly changing economic forces.This paper seeks to present an alternative. Instead of enhancing and improving on systems that became irrelevant with the invention of a database, instead of propping up an outdated, outmoded and inefficient system with incremental improvements; rewrite the paradigm. Change the underlying assertions to more accurately reflect our current technological capability. Instead of relying on evolutionary improvements, it is time for a revolution in manufacturing instructions.
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
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