Technical Library | 2019-11-13 02:09:44.0
Dry oven is a must instrument almost for every laboratory in different industries,with nearly 20 years efforts and innovation,Climatest now masters core technique of dry oven manufacturing,no matter on temperature uniformity or temperature stability.Behind the quality is 15 years of consistent persistence,strong belief in excellence; from design to R & D to production, from promotion to sales to installation; every step should reach excellence,What you see, you use our products, you choose, you feel that we do our best,this is our faith. Dry Ovens are used to dry or temper electronic components,material tests,torrefaction, wax-melting ,high temperature aging ,preheating and sterilization in industrial and mining enterprises, laboratories and scientific research institutes. .Exterior chamber is made by reinforced steel with painting; working chamber made by anti-corrosion stainless steel SUS#304 .Intelligent PID control, LED controller with over-temperature alarm,timing range within 0~9999min .Hot air circulation system composed of Germany imported low-noisy air blower and optimal air duct which ensure uniform temperature distribution .Double layers of glass door, large transparent window to observe specimen .Forced air convection Climatest manufactures desktop and floor-standing models with RT+10°C-200°C,250°C,300°C,350°C,400°C temperature range,and customized as per special requirement,if you wanna know more details about our dry oven,please visit our product page:https://climatechambers.com/industrial-dry-oven/200-degree-c-hot-air-oven.html
Technical Library | 2019-11-20 22:44:25.0
Salt spray test chamber is used to test teh salt corrosion resistance ability of hardware, metal and other auto parts,the chamber can quickly detect the corrosion resistance degree of products in the temperature, humidity and salt spraying environment, which can effectively improve production efficiency. So what is the reason why such a salt spray test chamber does not spray? As per our past maintenance experience,there are below reasons,customers can have a look,hope it is helpful: 1, the spray tower is blocked; 2, water pipes clogged, water flow can not go in; 3, the air compressor stops running,pls open the air compressor button; 4, main switch of the air compressor outlet is not turned on,pls turn on. 5, the solenoid valve fails, the pressure meter is broken or the pressure is too low, pls check with Climatest and repair it. 6, when the nozzle is clogged, the nozzle should be carefully removed and cleaned,because it is fragile. 7, if the spray pressure is normal, the position of the nozzle glass is also correct, but what is the reason for not spraying? In this case, it is necessary to carefully observe whether there is dirt at the contact surface of the nozzle. If so, clean up the dirt and the spray can be carried out normally. That‘s all we‘re going to talk about today. If you have any questions, follow us on facebook, Please feel free to ask us questions.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
