Technical Library: dek calibration board (Page 1 of 1)

Solder Paste Printing – the Most Critical Part of Building a Quality PCB Explained

Technical Library | 2017-11-03 13:39:06.0

If someone were to ask what the most important part of their favorite electronic device is, they are likely to point to the printed circuit board (PCB) responsible for making the device work before moving on to other components. From large motherboards to tiny chips, most of the technology that retail consumers take for granted comes down to a properly installed and calibrated PCB.

Power Design Services

Measuring Conformal Coating Thickness

Technical Library | 2015-07-21 13:50:37.0

Achieving an even coat at the right desired thickness is a major challenge when it comes to applying conformal coating to a Printed Circuit Board (PCB). Applying a coating too thin will ultimately render the electronic assembly vulnerable to potential environmental risks therefore defeating the purpose of the coating. Apply the coat too thick, and it could leave the electronic specific components non-functional therefore destroying the electronic assembly entirely. Coating thickness must meet quality specifications. Measurements for coating thickness may be taken while film is dry or wet. Once measurements are recorded, thickness is compared to quality specifications and fluid dispensing automation machinery is calibrated as necessary. There are a handful of methods for measuring conformal coating thickness that are commonly used in the Electronic Manufacturing Services (EMS) and Original Electronic Manufacturer (OEM) industries. A few commonly used methods for checking conformal coating thickness include:

ETS - Energy Technology Systems, Inc.

The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards

Technical Library | 2007-09-27 16:18:15.0

Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.

Universal Instruments Corporation

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