Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
Technical Library | 2020-08-05 17:13:12.0
A primary issue in electronics reliability for military applications is the ability to ensure long term operability in harsh, extreme environments. This requires more rigid standards, such as the MIL-STD-883 (Department of Defense Test Method Standard for Microcircuits), which commercial grade electronics typically do not satisfy. A solution commonly employed is to package the critical electronic components in hermetically sealed metal or ceramic enclosures which are costly and labor intensive. Not only are the components more expensive, but the assembly process is more difficult to automate, resulting in a substantial cost premium for military grade electronics.
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2007-10-02 22:09:50.0
The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share of the electronics market driven by Department of Defense (DoD) applications has created a niche market for RF qualified devices. The DoD, with its emphasis on COTS (Commercial Off The Shelf) and "Open" systems, is beginning to become more interested in using commercially oriented RF devices for military applications as a means to leverage the volumes and innovations of the commercial world.
Technical Library | 2021-10-12 18:08:28.0
Counterfeit components have been defined as a growing concern in recent years as demand increases for reducing costs. In fact the Department of Commerce has identified a 141% increase in the last three years alone. A counterfeit is any item that is not as it is represented with the intention to deceive its buyer or user. The misrepresentation is often driven by the known presence of defects or other inadequacies in regards to performance. Whether it is used for a commercial, medical or military application, a counterfeit component could cause catastrophic failure at a critical moment.
Technical Library | 2024-05-31 19:28:29.0
We strive to produce quality parts for customers around the world looking for laser cutting precision. We are able to produce quality machined parts to the specifications provided by customers because of the strong quality system. Precision parts with tight laser cut hole tolerances cannot be done without our quality department. Supplying quality machined parts defines who we are and laser micromachining wouldn't be possible without it.
Technical Library | 2012-03-08 20:08:57.0
You may have heard talk in the news lately regarding counterfeit electronic components making it into the US military supply chain. The U.S. Senate Armed Services Committee (SASC) recently reported in the Counterfeit Electronic Parts in the Defense Department Supply Chain hearing held on November 17, 2011, 1,800 cases of suspected counterfeit components that went into more than 1 million individual products. If you consider this number for the military, we can only imagine the number of counterfeits in our commercial yet high reliability products, such as life support or other critical systems. If you are the person within your electronics-based company who must perform risk analyses, counterfeiting is not a new concern, yet many do not realize just how good counterfeiters have become at their "trade".
Technical Library | 2021-08-04 18:36:17.0
In this paper, the existing status of PCB manufacturing environment and future development towards smart manufacturing system (SMS) are discussed. A cloud manufacturing system (CMS) paradigm is introduced in the existing PCB manufacturing environment to get easy access to resources, materials, manufacturing processes, planning problems and data sharing networks. The goal is to integrate the information sharing from planning problems, PCB assembly lines, retailer and shipment department to CMS for smart planning decisions to cope with the increasing demand and profit enhancement strategies. A conceptual framework is presented to introduce the smart manufacturing environment in the traditional PCB manufacturing system. The suggested framework of SMS helps to improve the performance of PCB manufacturing industries regarding smart planning and scheduling, intelligent monitoring of smart assembly lines for efficiency and production enhancement.
Technical Library | 1999-05-07 08:55:49.0
Failure analysis (FA) is one of the key competencies in Intel. It enables very rapid achievement of world class manufacturing standards, resulting in excellent microprocessor time-to-market performance. This paper discusses the evolution of FA techniques from one generation of microprocessors to another.
Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
