Technical Library: depend (Page 2 of 7)

"High Reliability Products" What does it really take - A Test Perspective

Technical Library | 2006-12-04 16:38:18.0

This paper will explore how test can be an integral part of manufacturing to assure High Reliability Products. We will discuss how test parameters and test techniques are effective in finding time zero vs. time dependent defects. Understanding of manufacturing processes in terms defect levels as well as defect types is very critical in defining test parameters, new test techniques and test alternatives. This ultimately can improve the yield, quality, and reliability. We will discuss the types of defects, time zero vs. time dependent defects, test parameters and effectiveness and new test techniques to find time dependent defects.

i3 Electronics

Augmentation Improves Thermal Performance of Air Cooled Heat Sinks.

Technical Library | 1999-05-06 10:30:06.0

Augmentation of extended surfaces used to dissipate heat increases the overall effectiveness of a heat sink and increases the heat removed per unit volume. This amount of increase depends on the number of augmentations, air flow velocity and ...

Aavid Thermalloy, LLC

THT in-line Inspection: Contradiction or greater Efficiency?

Technical Library | 2010-07-22 18:10:17.0

The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic assemblies. Depending on batch size and product mixture, AOI systems as Inline integration or as a stand-alone solution benefit efficien

GOEPEL Electronic

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

Technical Library | 2010-11-06 02:44:38.0

An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on

Samtec, Inc.

Miniaturization of Cooling Solutions

Technical Library | 1999-05-06 11:52:21.0

The market's demand for increasingly powerful products, in smaller and smaller packaging, creates a cooling problem. Integrated circuit (IC) lifetime is dependent upon its operating temperature, creating a trade-off situation: either you enlarge the package to accept additional cooling, or you sacrifice IC lifetime.

Aavid Thermalloy, LLC

Keeping Tin Solderable

Technical Library | 1999-05-06 15:31:13.0

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...

TE Connectivity

What Type of PCB Substrate Material Is Right for Your PCB?

Technical Library | 2017-01-24 02:15:49.0

Basic performance of PCB (Printed Circuit Board) depends on the performance of substrate material. In order to improve the performance of PCB, you have to increase the performance of PCB substrate material first. This article introduces how to chose PCB substrate material for your custom PCB project from multiple perspectives.

PCBCart

Comparing Techniques for Temperature-Dependent Warpage Measurement

Technical Library | 2008-03-13 13:02:50.0

Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.

Akrometrix

Inventory Efficiency In The Supply Chain

Technical Library | 2001-05-23 16:23:26.0

Lowering inventories is one of the quickest ways to decrease working capital needs. Performance measurements, such as the old standby ROA (return on assets) and the newer EVA (economic value added), as well as other measures that gauge how efficiently capital is used, have become more common organizational drivers. In fact, many an executive’s bonus depends, at least in part, on how efficiently capital is used.

R. Michael Donovan & Co., Inc.

Fragility of Pb-free Solder Joints

Technical Library | 2007-04-18 19:23:22.0

Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service.

Universal Instruments Corporation


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