Technical Library: differ (Page 4 of 22)

Six Ways to Cut Stainless Steel

Technical Library | 2024-12-03 16:50:16.0

A brief description of six different types of manufacturing methods you can use to have stainless steel cut.

A-Laser, Inc.

What are the materials for plastic anti static ic tubes?

Technical Library | 2019-01-08 02:00:27.0

Plastic ic tubes can be made of plastics of various materials such as PVC, PS, PET, PC, ABS, etc. The shipping tubes of different materials will have different performances. The characteristics of various materials and their packaging tubes are described in detail below;

Shenzhen Sewate Technology Co.,Ltd

Paper Substrates and Inks for Printed Electronics

Technical Library | 2023-03-13 19:40:21.0

The present work explores the effects of paper properties on conventional silver-based conducting inks. The effects of smoothness, relative humidity, porosity, permeability and wettability on electrical properties of silver inks on different paper substrates were studied. Another objective of this work was to prepare and study polyaniline synthesized in the presence of different lignosulfonates.

Western Michigan University

A Study of Lead-Free Solder Alloys

Technical Library | 1999-05-09 14:14:51.0

With the ongoing concern regarding environmental pollutants, Iead is being targeted in the electronic assembly arena. This paper highlights lead-free solders and the different combinations of elemental makeups.

AIM Solder

Evaluation of Under-Stencil Cleaning Papers

Technical Library | 2016-08-04 14:33:23.0

Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen printing is the under stencil cleaning process and one of the key materials in this process is the cleaning paper1. This, often neglected, material affects the cleaning process and thereby also the print quality. It is therefore important to perform tests of different cleaning papers before one could be chosen. This article describes how cleaning papers can be tested and it also tells how big differences it can be between different materials.

Ericsson AB

Effect Of Squeegee Blade On Solder Paste Print Quality

Technical Library | 2010-06-17 20:48:04.0

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.

Speedline Technologies, Inc.

Robust Reliability Testing For Drop-on-Demand Jet Printing

Technical Library | 2020-03-19 00:23:15.0

In this study, the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids, such as solder paste and conductive adhesives. The goal of this study was to develop a general method for hypothesis testing when robustness tests are performed. The main problem was to determine if there was a statistical difference between two means or proportions of jet printing devices. In this study, an example of jetting quality variation was used when comparing two jet printing ejector types that differ slightly in design. We wanted to understand if the difference in ejector design can impact jetting quality by performing robustness tests. and thus answer the question, "Can jetting differences be seen between ejector design 1 and design 2"?

Mycronic AB

Bare PCB inspection for Track cut, Track Short and Pad Damage using simple Image Processing Operations

Technical Library | 2021-05-06 13:48:05.0

In this paper most commonly occurring Bare PCB defects such as Track Cut, Track short and Pad Damages are detected by Image processing techniques. Reference PCB without having any defects is compared with test PCB having defects to identify the defects and x-y coordinates of the center of the defects along with radii are obtained using Difference of Gaussian method and location of the individual type of defects are marked either by similar color or different colors. Result Analysis includes time taken for the inspection of a single defect, multiple similar defects, and multiple different defects. Time taken is ranging from 1.674 to 1.714 seconds if the individual type of defects are marked by different colors and 0.670 to 0.709 seconds if all the identified defects are marked by the same colors.

Vidya Vikas Institute Of Engineering And Technology

SMD Nomenclature - in Plain English

Technical Library | 2000-11-13 20:16:17.0

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included.

TopLine Dummy Components

Cost Analysis of Printed Circuit Boards

Technical Library | 2004-05-23 17:18:26.0

This is an article written by our company's experts to help our customers to make informed decision on PC boards purchasing. It introduces the materials that are used in the PCB manufacturing and the cost analysis of different materials.

Gold Phoenix PCB Co, Ltd


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