Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
Technical Library | 2023-12-06 03:28:49.0
Mastering Precision: I.C.T's SMT Conformal Coating Valves Introduction Of SMT Conformal Coating Valves: In various industries, including electronics, lighting, energy, and life sciences, the SMT conformal coating process plays a critical role. Precision is key, and the choice of a SMT coating valve significantly influences application quality. This article explores I.C.T's SMT conformal coating valves, focusing on the C-0101, C-L101, PJ-01, PJ-01 (with plastic bucket), C-0100, D-0100, D-0300, and the W Series. C-0101 Water Curtain Spray SMT Conformal Coating Valves: The C-0101, a non-atomizing water curtain spray valve, excels with low-viscosity solvent materials. It ensures clean and precise edges in applications like conformal coatings, UV adhesives, backfilling, and volatile substances. C-L101 Rotary Water Curtain Spray Valve: Similar to the C-0101, the C-L101 suits low-viscosity solvent materials, offering a precise edge without splashing for various coatings. PJ-01 Injection Valve (Without Plastic Bucket): Designed for high-precision applications in electronics, lighting, energy, and life sciences, the PJ-01 excels in accurate dispensing and coating. It accommodates various materials, including red glue, liquids, and pastes. PJ-01 Injection Valve (With Plastic Bucket 30CC): The PJ-01, with a 30cc plastic bucket, maintains high precision for complex circuit board applications, offering precise dispensing for materials like red glue, liquids, and pastes. C-0100 Non-Rotating Film Valve: Different from pneumatic atomizing valves, the C-0100 provides precise edge definition without air pressure involvement. It addresses issues related to atomizing drift and fast-drying adhesives, allowing control over the film width. D-0100 Precision Valve: The D-0100, with a unique fluid-sealing structure driven by compressed air, minimizes seal replacement frequency. Suitable for various fluid dispensing, it handles UV adhesives, encapsulating materials, silicones, epoxies, and surface coatings. D-0300 Dispensing Valve: Tailored for precision fluid dispensing at low driving pressure, the D-0300 accommodates a range of materials, including acrylics, silicones, epoxies, and UV adhesives. It's ideal for applications where accuracy and consistency are crucial. W Series: Needle Design Atomization Valves: The W Series offers needle design valves leaving zero residue. Easy to clean without disassembly, they provide adjustable fluid and air pressure for various coating materials, ensuring excellent atomization effects. Analyzing The Options: When selecting a conformal coating valve, consider specific application requirements. C-0101 and C-L101 suit low-viscosity solvent materials, providing clean and precise edges. PJ-01, with or without a plastic bucket, offers high-precision dispensing for complex applications. C-0100 and D-0100 are versatile for various materials, and D-0300 excels in precision dispensing. The W Series offers residue-free needle design atomization valves. Choose based on material, precision, and coating needs. Integration with I.C.T's Conformal Coating Machines: Integral to I.C.T's Conformal Coating machines, these valves enable precise application tailored to specific requirements. Machines like I.C.T-T550, I.C.T-T550U, I.C.T-T600, and I.C.T-T650 come equipped with a range of valve options catering to diverse production line needs. I.C.T SMT Coating Machine.png Conclusion: Selecting the right conformal coating valve is crucial for consistent, high-quality results. Evaluate options based on material, precision, and coating requirements. I.C.T provides tailored solutions for electronic assembly needs. For detailed insights into coating and dispensing machines, follow the provided link. Professional engineers are ready to assist in designing a production line that perfectly matches your requirements, ensuring optimal performance. Contact us for more information and tailored solutions to elevate your conformal coating processes.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2015-08-25 13:51:27.0
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Technical Library | 2020-03-12 13:10:35.0
The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Technical Library | 2021-11-16 22:17:27.0
Ultrasonics, coupled with an aqueous detergent process that cleans at below 43ºC, may be best suited for fine-pitch SMT screens and stencils. Aqueous detergents clean more effectively than solvents, with little or no environmental impact. Because of the environmental concerns driving today's technology decisions, the once simple decision of selecting a stencil cleaning process is now clouded with different chemicals, different cleaning machines and various types of solder paste, all with specific environmental, health and safety related issues and regulations.
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