Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
Technical Library | 2016-07-14 18:21:29.0
Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that make connections. Both PCB and PE technologies have been in use for a long time in one form or another with PCBs currently the standard for complex, high speed electronics and PE for user interface, complex form factor or other film based applications. New and innovative applications create the opportunity for promising structures. Taking advantage of the PCB shop's capability as well as the material set can help create these structures and indeed PE materials can find use in more traditional PCBs. New materials and new uses of existing materials open up many possibilities in electronic interconnecting structures. PCB manufacturers have a complex manufacturing infrastructure, well suited for both additive and subtractive conductor processing. While built around rigid material processing (flex PCB being the exception), there are opportunities for PE substrate processing. As electronics devices are applied to more and more parts of our lives, we need to continually push for better solutions. Fit, function, manufacturability, and cost are all important considerations. Crossing the PCB/PE boundary is a way to meet the challenge.
Technical Library | 2020-01-01 17:06:52.0
The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.
Technical Library | 1999-05-07 10:13:38.0
This paper will review the device physics governing the operation of the industry standard ETOX™ flash memory cell and show how it is ideally suited for multiple bit per cell storage, through its storage of electrons on an electrically isolated floating gate and through its direct access to the memory cell.
Technical Library | 2008-02-05 22:48:55.0
This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders. The influence of added elements on the electrical and mechanical properties of solder joints created by these solders between PCB and electronic components were evaluated.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
Technical Library | 2013-08-01 13:17:44.0
Electronic industry uses a number of metallic materials in various forms. Also new materials and technology are introduced all the time for increased performance. In recent years, corrosion of electronic systems has been a significant issue. Multiplicity of materials used is one reason limiting the corrosion reliability. However, the reduced spacing between components on a printed circuit board (PCB) due to miniaturization of device is another factor that has made easy for interaction of components in corrosive environments. Presently the knowledge on corrosion issues of electronics is very limited. This paper reviews briefly the materials used in electronic systems, factors influencing corrosion, types of corrosion observed in electronics, and testing methods.
Technical Library | 2020-03-12 13:10:35.0
The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Technical Library | 2020-06-10 01:42:55.0
Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics.
Technical Library | 2020-08-13 01:12:57.0
The solar industry has driven solutions that result in electronics systems that are required to perform in outside environments for over 25 years. This industry expectation has resulted in solutions to protect the electronics from failure that can result from interaction with moisture, and various chemicals leading to corrosion and shorting of the systems. Potting and encapsulation compounds can impart the very high level of protection from environmental, thermal, chemical, mechanical, and electrical conditions that the solar applications demand.
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
