Technical Library | 2015-01-08 17:26:59.0
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern
Technical Library | 2013-04-12 08:20:15.0
There is much to read about the shifting sands of electronics manufacturing, including current moves by OEMs to alter their EMS relationships to better mitigate risk and cost, while EMS companies look for additional ways in which to adjust their business models in an attempt to improve their profitability. Electronics outsourcing over time evolved from a means to buffer manufacturing demand fluctuations into a wide scale shift in capabilities, in part in order to deal with vastly shorter product life cycles. Following the global economic crash of 2000, aka “the internet bubble,” more and more EMS providers responded by transferring their manufacturing to low cost labour regions, and in particular China.
Technical Library | 2018-10-31 20:35:49.0
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing
Technical Library | 2010-02-03 14:50:51.0
This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals.
Technical Library | 2023-03-13 19:12:56.0
Printed electronics (PE) is impacting almost every branch of manufacturing. The printing of electronics on mechanically flexible substrates such as plastic, paper and textile, using traditional printing techniques, provides novel applications for wearable and stretchable electronics. Government sponsored consortiums, universities, contract printers, startups and global manufacturers are developing processes to bring this technology to market faster, more costeffectively and at scale. By increasing the speed of technology adoption while following industrialization best practices, industry researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
Technical Library | 2023-11-20 17:59:32.0
Quality control at Mentzer Electronics in Burlingame, California, includes tracing electronics assembly issues using a Metris XT V real-time X-ray inspection system. This electronics X-ray inspection system allows quality engineers to intuitively navigate through the internal structure of assembled PCBs. In the rapidly evolving electronics industry, Mentzer Electronics uses the acquired insight to speed up and fi ne tune manufacturing processes. Real-time X-ray guarantees that no hidden defects remain in products when turning them out to customers nationwide.
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
Technical Library | 2010-04-15 22:06:32.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
Technical Library | 2021-08-18 01:24:20.0
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate.
Technical Library | 2021-07-06 21:24:59.0
The amount of information transferred on wireless networks has increased dramatically with the tremendous growth of mobile phones, Internet access, and hand held devices. In order to build the infrastructure needed to handle ever increasing data transfer, manufacturers of electronic devices turn to high speed, high frequency electronic signals. The need to render these electronic devices portable is another technology driver. The merge of high-frequency signals with small geometry conductive traces means that the topic of signal loss has reached a critical point in existing device production.
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
