Technical Library | 2023-08-18 03:28:47.0
Today, KINGSUN shares with you the common types and classifications of SMT mounters. 一、According to the feeding method, common ones include: 1.Tape Feeder 2.Tray Feeder 3.Tube Feeder 4.Stick Feeder 5.Special Vibration Feeder 二、According to the classification of electric and non electric, the common ones are electric feeder and mechanical feeder. Yamaha's SIGMA SMT machines are all electric feeders, while many of JUKI's feeder are mechanical feeders...... Regarding feeders related knowledge, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com . "DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" is a leading SMT automation equipment factory provider in China. With many years of profound experience accumulation, we provides comprehensive solutions for global customers with strong resources and high-quality professional technical team.
Technical Library | 2021-12-31 06:09:47.0
The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk.
Technical Library | 2019-07-27 07:13:16.0
Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning.
Technical Library | 2022-09-29 14:08:42.0
Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
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Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
