Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
Technical Library | 2019-11-17 22:46:45.0
Overview of walk-in temperature and humidity chamber: It also belongs to environmental test equipment, it tests whether the product can resist high temperature, low temperature, humidity, or the physical and chemical changes produced under extreme conditions, the walk-in temperature and humidity chamber volume is large, the product is placed, or a large object can be placed, such as automobile, new energy, television and liquid crystal screen, etc. How to do the routine maintenance of the walk-in temperature and humidity chamber: 1. The wet gauze basically, if there is no special case, s/b usually changed once in 3 months 2. The water channel shall be regularly cleaned, including water cup, water tank, etc., so as to prevent the water from being blocked,affect the humidity test. 3. It is forbidden to test the flammable and explosive products inside working room. 4. Clean the chamber on a regular basis 2. How to operate walk-in temperature and humidity chamber: The operation method is same as standard temperature humidity test chamber,the controller is 7-inch LCD programmable color screen, you only need to setthe temperature point---test time--how many cycles need to be tested, This can be done automatically, and the machine will stop automatically when it is complete. If there is any problem during the operation, the corresponding problem point will be displayed on the machine control screen. Walk-in temperature and humidity chamber is a must equipment for reliability test of Automobile,Aerospace,Electronic parts,etc,the operation and maintenance are easy,it is teh tear down mahcine,Climatest engineers will be dispatched to do on-site support,for instance,we will finish commissioning,train customers how to operate,maintain,welcome to follow our company facebook page:https://www.facebook.com/Climatechambers
Technical Library | 2016-03-24 17:37:09.0
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization, mobility and connectivity. Consequently, there will raise up a lot of new business models for the electronic industry. Connectivity will take a large influence on our lives. Concepts like Industry 4.0, internet of things, M2M communication, smart homes or communication in or to cars are growing up. All these applications are based on the same demanding requirement – a high amount of data and increased data transfer rate. These arguments bring up large challenges to the Printed Circuit Board (PCB) design and manufacturing.This paper investigates the impact of different PCB manufacturing technologies and their relation to their high frequency behavior. In the course of the paper a brief overview of PCB manufacturing capabilities is be presented. Moreover, signal losses in terms of frequency, design, manufacturing processes, and substrate materials are investigated. The aim of this paper is, to develop a concept to use materials in combination with optimized PCB manufacturing processes, which allows a significant reduction of losses and increased signal quality.
Technical Library | 2017-04-20 13:51:14.0
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Technical Library | 2016-01-12 11:09:47.0
In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for used in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Technical Library | 2021-06-07 19:03:05.0
The waste from end-of-life electrical and electronic equipment has become the fastest growing waste problem in the world. The difficult-to-treat waste-printed circuit boards (WPCBs), which are nearly 3−6 wt % of the total electronic waste, generate great environmental concern nowadays. For WPCB treatment and recycling, the mechanical−physical method has turned out to be more technologically and economically feasible. In this work, the mechanical−physical treatment and recycling technologies for WPCBs were investigated, and future research was directed as well. Removing electric and electronic components(EECs) from WPCBs is critical for their crushing and metal recovery; however, environmentally friendly and high-efficiency removal techniques need be developed. Concentrated metals rich in Cu, Al, Au, Pb, and Sn recovered from WPCBs need be further refined to add to their economic values. The low value added nonmetallic fraction of waste-printed circuit boards (NMF-WPCBs) accounts for approximately 60 wt % of the WPCBs. From the perspective of environmental management, a zero-waste approach to recycling them should be developed to gain values. Preparing polymer composites and geopolymers offers many advantages and has potential applications in various fields, especially as construction and building materials. However, the mechanical and thermal properties of NMF-WPCBs composites should be further improved for preparing polymer composites. Surface modification or filler blending could be applied to improve the interfacial comparability between NMF-WPCBs and the polymer matrix. The NMFWPCBs shows potential in preparing cement mortar and geological polymers, but the environmental safety resulting from metals needs to be taken into account. This study will provide a significant reference for the industrial recycling of NMF-WPCBs
Technical Library | 2019-12-13 00:39:29.0
Salt spray corrosion chamber can test the ability of material and its protective layer to resist salt mist corrosion, or compare the process quality of similar protective layers, at the same time; this equipment is suitable for parts, electronic components, protective layer of metal material and other industrial products. Salt spray test is divided into neutral and acid test. What is the difference between neutral and acid in salt spray test? First, the temperature applied in the test method is different: Neutral test: a. Laboratory:35°C ±1°C, b. Saturated air drums:47°C ±1°C Acid test: a. Laboratory:50°C ±1°C, b. Saturated air drums:63°C ±1°C Second, the production material is different,neutral test chamber adoptes the traditional PVC plates, acid test chamber asopts PP sheet,which is more high temperature resistance and suits strong acid test. Third. Different test methods satisfied Neutral salt spray chamber according to GB/T 2423.17-2008, GB/T 2423.18-2000, salt spray test method and GB/T 10125-1997, GB/T 10587-2006, GB10593.2-1990, GB/T 1765-1979, GB/T 1771-2007, GB/T 12967.388, GB/T 1705.8-2008, etc. In addition to the test methods specified in the national standard, acid salt spray chamber also needs to expand the standard setting such as IEC,MIL,DIN,ASTM,IS,CNS. Last, Comparison of neutral test solutions China: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 United States: distilled water solution NaCI mass concentration 5% ±1% pH value 6.5 ≤ 7.2 Germany: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 Japan: NaCI distilled water solution NaCI mass concentration 5% ±1% pH pH value 6.5 ~ 7.2 France: NaCI distilled water solution NaCI mass concentration 5% pH 6.5 ≤ 7.2 https://climatechambers.com/articles&latestnews/difference-between-neutral-and-acid-salt-spray-corrosion-test.html
Technical Library | 2019-05-02 13:47:39.0
Automating electronics assembly is complex because many devices are not manufactured on a scale that justifies the cost of setting up robotic systems, which need frequent readjustments as models change. Moreover, robots are only appropriate for a limited part of assembly because small, intricate devices are particularly difficult for them to assemble. Therefore, assembly line designers must minimize operational and readjustment costs by determining the optimal assignment of tasks and resources for workstations. Several research studies address task assignment issues, most of them dealing with robot costs as fixed amount, ignoring operational costs. In real factories, the cost of human resources is constant, whereas robot costs increase with uptime. Thus, human workload must be as large and robot workload as small as possible for the given number of humans and robots. We propose a new task assignment method that establishes a workload balancing that meet precedence and further constraints.
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