Technical Library: electronics assembly fixture (Page 9 of 25)

Dealing with the Top Five Factory Floor Productivity Killers in the PCB Industry

Technical Library | 2009-04-16 22:38:55.0

The worldwide electronics industry has sales of $750 billion, two thirds of which is accounted for by PCB assembly. PCB manufacturing is characterised by an obsessive drive for increased productivity in the context of three significant industry drivers: shorter product lifecycles, more complexity, outsourcing

Mentor Graphics

What Cannot Be Cleaned In a Stencil Cleaner

Technical Library | 2009-09-18 14:48:58.0

The stencil cleaner can be one of the most versatile tools on the manufacturing floor. It can be used to clean electronic modules in various stages of the manufacturing process. In fact, an automated stencil cleaner can clean just about anything you come up against in your PCB assembly process.

Austin American Technology

Manufacturing Substrates with Embedded Passives

Technical Library | 2011-05-05 16:17:34.0

Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v

i3 Electronics

Warpage Measurement of PCB With 3D Metrology

Technical Library | 2011-06-09 13:29:17.0

Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla

NANOVEA

why need Under vaccum potting machine for motor stator iginition coil

Technical Library | 2021-12-31 06:55:24.0

Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics

Guangzhou Daheng Automation Equipment Co.,LTD

why need Under vaccum potting machine for motor stator iginition coil

Technical Library | 2021-12-31 06:56:02.0

Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics

Guangzhou Daheng Automation Equipment Co.,LTD

WHY test for Ionic Contamination?

Technical Library | 2023-04-17 21:37:32.0

Ionic contamination is a leading cause in the degradation and corrosion of electronic assemblies, leading to lifetime limitation and field failure (Fig. 1). Ionic residue comes from a variety of sources shown in Fig. 2 opposite: Examples of ionic contaminants: * Anions * Cations * Weak Organic Acid

Specialty Coating Systems

3D Assembly Process a Look at Today and Tomorrow

Technical Library | 2016-04-21 14:10:55.0

The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Traditional printed circuit boards utilize the x/y plane and many miniaturization techniques apply to the x/y space savings, such as smaller components, finer pitches, and closer component to component distances.This paper will explore the evolution of 3D assembly techniques, starting from flexible circuit technology, cavity assembly, embedded technology, 3 dimensional surface mount assembly, etc.

Flex (Flextronics International)

Lead-free Rework Process For Chip Scale Packages

Technical Library | 2007-03-28 10:18:33.0

Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.

Universal Instruments Corporation

Lead-Free Soldering Guide

Technical Library | 2014-05-12 15:32:17.0

The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What was once an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter.

AIM Solder


electronics assembly fixture searches for Companies, Equipment, Machines, Suppliers & Information

Nordson Electronics Solutions
Nordson Electronics Solutions

Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.

Manufacturer

2747 Loker Ave West
Carlsbad, CA USA

Phone: 18002796835