Technical Library | 2008-08-28 22:50:11.0
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.
Technical Library | 2007-05-02 15:00:17.0
This brief study of lead-free wave soldering focuses upon copper dissolution and solder maintenance issues. Unfortunately, it is determined that waste and changeover costs can dramatically increase with lead-free wave soldering.
Technical Library | 2006-05-13 13:07:53.0
This Excel Spreadsheet calculates the Wave Solder Contact Time automatically with given main Solder Wave width and Conveyor Speed. There is one chart where conveyor speed is expressed in meters/min and in another where it is expressed in feet/minute.
Technical Library | 2009-02-13 12:29:39.0
To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering
Technical Library | 2008-01-24 16:19:43.0
The wave solder process is characterized by a large number of process parameters. To understand them all and their interactions is challenging, particularly when it comes to lead-free soldering. Wave soldering has a number of sub-processes, which include fluxing, preheating, soldering and cooling.
Technical Library | 2011-01-27 16:57:42.0
In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering..
Technical Library | 2018-02-14 22:58:54.0
This document describes general guidelines and attention points for PCB design regarding selective soldering. The guidelines can be applied for Select Wave and/or Multi Wave soldering process in both leaded and leadfree alloy. When a PCB is designed according to these guidelines, a stable and solid solder-process can be guaranteed.
Technical Library | 2012-07-05 06:10:59.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. A new innovation for increasing quality & productivity of wave soldering machines.
Technical Library | 2020-04-29 03:25:11.0
1CLICKSMT has recently installed a odd form component inserting and wave soldering line for a security products manufacturer.
Technical Library | 2008-02-12 22:52:41.0
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.
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