Technical Library: ems companies (Page 1 of 1)

Improving Quoting Means Improving Your Whole Business

Technical Library | 2016-07-29 10:28:22.0

The RFQ process has been treated as a tedious and necessary evil by most EMS companies. However, a mature quoting process can improve your company's ability to win new business, keep existing customers and improve margins.

CalcuQuote

“Near-Shoring” Electronics Manufacturing

Technical Library | 2013-04-12 08:20:15.0

There is much to read about the shifting sands of electronics manufacturing, including current moves by OEMs to alter their EMS relationships to better mitigate risk and cost, while EMS companies look for additional ways in which to adjust their business models in an attempt to improve their profitability. Electronics outsourcing over time evolved from a means to buffer manufacturing demand fluctuations into a wide scale shift in capabilities, in part in order to deal with vastly shorter product life cycles. Following the global economic crash of 2000, aka “the internet bubble,” more and more EMS providers responded by transferring their manufacturing to low cost labour regions, and in particular China.

JJS Electronics LTD

AOI Capabilities Study with 03015 Component

Technical Library | 2019-01-23 21:33:32.0

Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process, reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting1-3. Because of this, more Electronic Contract Manufacturing Services (EMS) companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of component package 03015 which is challenging for AOI.

Flex (Flextronics International)

Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu

Technical Library | 2014-01-23 16:49:55.0

As reliability requirements increase, especially for defense and aerospace applications, the need to characterize components used in electronic assembly also increases. OEM and EMS companies look to perform characterizations as early as possible in the process to be able to limit quality related issues and improve both assembly yields and ultimate device reliability. In terms of BGA devices, higher stress conditions, RoHS compatible materials and increased package densities tend to cause premature failures in intermetallic layers. Therefore it is necessary to have a quantitative and qualitative test methodology to address these interfaces.

Universal Instruments Corporation

How Reshoring Drives Profitability

Technical Library | 2016-05-05 15:19:39.0

For many years, manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essential element to make off-shore transfer happen more quickly, offering further cost reduction opportunities from load balancing. Fierce arguments were put forward to protect the loss of local jobs, although the result was, in almost all cases, inevitable. Today, however, the whole market of PCBbased electronics products has changed significantly. The "pros" of off-shoring are no longer what they once were, and the "cons" are becoming more significant because off-shore manufacturing can no longer satisfy the needs of the market. In this paper, we expose the real costs of off-shore manufacturing, and put labour cost differentials into perspective. We demonstrate how practically, using existing technologies, re-shored manufacturing can yield better business return, either for an OEM, or through EMS providers.

Mentor Graphics

Implementing Warpage Management: A Five-Step Process for EMS Providers

Technical Library | 2014-08-19 16:07:15.0

Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs.

Akrometrix

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