Technical Library: endicott interconnect (Page 1 of 1)

Printable Nanocomposites for Electronic Packaging

Technical Library | 2008-06-25 16:11:51.0

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology.

i3 Electronics

An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections

Technical Library | 2009-01-01 16:37:38.0

Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste.

i3 Electronics

Testing To Eliminate Reliability Defects From Electronic Packages

Technical Library | 2006-06-29 13:37:36.0

Electronic Packaging is a critical part of all electronic devices and can be a source of the reliability problems experienced by systems using those devices. In many cases, the packaging defects are intermittent in nature and difficult to detect. This paper describes a tester that has been used for 20 years on commercial products and has proven to be extremely effective in detecting these defects prior to component assembly.

i3 Electronics

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