Technical Library: engineer kester (Page 1 of 1)

Manufacturing Considerations When Implementing Voc-Free Flux Technology

Technical Library | 1999-05-07 11:44:26.0

In 1990 the United States Environmental Protection Agency Issued the Clean Air Act. The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries.

Kester

Developing a Reliable Lead-free SMT Process

Technical Library | 2008-01-03 17:50:51.0

Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.

Kester

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Technical Library | 2009-02-13 12:29:39.0

To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering

Kester

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Technical Library | 2009-01-15 00:42:58.0

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.

Kester

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