Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-15 09:44:44.0
Elevate your electronics assembly with the Desk Automatic SMT Dispensing Machine. Ensure accuracy and efficiency in solder paste and adhesive dispensing. Ideal for professionals and hobbyists alike.
Technical Library | 2023-09-15 11:17:10.0
Ensure the integrity of your components with our SMT Offline X-Ray System. Detect hidden defects and improve the quality of your PCBAs with precise X-ray inspection technology.
Technical Library | 2023-09-13 12:48:06.0
PCB cleaning machines are essential for ensuring the quality and reliability of printed circuit boards (PCBs). These machines remove contaminants and debris from PCBs, which can cause defects and reliability issues.
Technical Library | 2023-09-15 09:47:24.0
Explore our PCBA Coating Line introduction to safeguard your electronics. Discover the best coatings for PCBAs to protect against environmental factors and ensure long-lasting reliability.
Technical Library | 2023-09-15 10:03:06.0
Enhance PCB assembly quality with our DIP Line Online PCBA AOI solution. Detect defects in real-time, streamline your production, and ensure top-notch quality assurance for your electronic components.
Technical Library | 2023-09-15 11:15:49.0
Experience unmatched component inspection precision with our SMT Offline X-Ray solution. Detect defects, ensure quality, and boost production efficiency with advanced X-ray technology.
Technical Library | 2023-09-13 13:04:47.0
SMT nozzle cleaning machines are essential for ensuring the quality and reliability of SMT assembly processes. These machines remove contaminants and debris from SMT nozzles, which can cause defects and reliability issues.
Technical Library | 2023-09-15 10:00:02.0
Experience top-tier quality inspection with our DIP Inverted Camera Online PCBA AOI solution. Ensure flawless PCB assemblies and detect defects with precision using advanced technology. Improve efficiency and minimize production issues with this cutting-edge automated optical inspection system.
Technical Library | 2023-09-15 10:03:54.0
Achieve thorough quality control with our DIP On-line Dual Side PCBA AOI system. Detect defects on both sides of PCBAs in real-time, ensuring impeccable quality and production efficiency. Elevate your electronic manufacturing process today.
