Technical Library | 2023-12-06 03:28:49.0
Mastering Precision: I.C.T's SMT Conformal Coating Valves Introduction Of SMT Conformal Coating Valves: In various industries, including electronics, lighting, energy, and life sciences, the SMT conformal coating process plays a critical role. Precision is key, and the choice of a SMT coating valve significantly influences application quality. This article explores I.C.T's SMT conformal coating valves, focusing on the C-0101, C-L101, PJ-01, PJ-01 (with plastic bucket), C-0100, D-0100, D-0300, and the W Series. C-0101 Water Curtain Spray SMT Conformal Coating Valves: The C-0101, a non-atomizing water curtain spray valve, excels with low-viscosity solvent materials. It ensures clean and precise edges in applications like conformal coatings, UV adhesives, backfilling, and volatile substances. C-L101 Rotary Water Curtain Spray Valve: Similar to the C-0101, the C-L101 suits low-viscosity solvent materials, offering a precise edge without splashing for various coatings. PJ-01 Injection Valve (Without Plastic Bucket): Designed for high-precision applications in electronics, lighting, energy, and life sciences, the PJ-01 excels in accurate dispensing and coating. It accommodates various materials, including red glue, liquids, and pastes. PJ-01 Injection Valve (With Plastic Bucket 30CC): The PJ-01, with a 30cc plastic bucket, maintains high precision for complex circuit board applications, offering precise dispensing for materials like red glue, liquids, and pastes. C-0100 Non-Rotating Film Valve: Different from pneumatic atomizing valves, the C-0100 provides precise edge definition without air pressure involvement. It addresses issues related to atomizing drift and fast-drying adhesives, allowing control over the film width. D-0100 Precision Valve: The D-0100, with a unique fluid-sealing structure driven by compressed air, minimizes seal replacement frequency. Suitable for various fluid dispensing, it handles UV adhesives, encapsulating materials, silicones, epoxies, and surface coatings. D-0300 Dispensing Valve: Tailored for precision fluid dispensing at low driving pressure, the D-0300 accommodates a range of materials, including acrylics, silicones, epoxies, and UV adhesives. It's ideal for applications where accuracy and consistency are crucial. W Series: Needle Design Atomization Valves: The W Series offers needle design valves leaving zero residue. Easy to clean without disassembly, they provide adjustable fluid and air pressure for various coating materials, ensuring excellent atomization effects. Analyzing The Options: When selecting a conformal coating valve, consider specific application requirements. C-0101 and C-L101 suit low-viscosity solvent materials, providing clean and precise edges. PJ-01, with or without a plastic bucket, offers high-precision dispensing for complex applications. C-0100 and D-0100 are versatile for various materials, and D-0300 excels in precision dispensing. The W Series offers residue-free needle design atomization valves. Choose based on material, precision, and coating needs. Integration with I.C.T's Conformal Coating Machines: Integral to I.C.T's Conformal Coating machines, these valves enable precise application tailored to specific requirements. Machines like I.C.T-T550, I.C.T-T550U, I.C.T-T600, and I.C.T-T650 come equipped with a range of valve options catering to diverse production line needs. I.C.T SMT Coating Machine.png Conclusion: Selecting the right conformal coating valve is crucial for consistent, high-quality results. Evaluate options based on material, precision, and coating requirements. I.C.T provides tailored solutions for electronic assembly needs. For detailed insights into coating and dispensing machines, follow the provided link. Professional engineers are ready to assist in designing a production line that perfectly matches your requirements, ensuring optimal performance. Contact us for more information and tailored solutions to elevate your conformal coating processes.
Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Technical Library | 2017-08-24 16:53:20.0
With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL's, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. (...) This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Technical Library | 2009-10-08 01:58:04.0
In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described.
Technical Library | 2015-11-12 19:04:51.0
In order to provide the functionality in today’s electronics, printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces, this means no nodules, no pits, and excellent ductility with thinner deposits. One of the areas that has to change to get to this plateau of technology is acid copper plating. Acid copper systems have changed in minor increments since their introduction decades ago. However, the basic cell design using soluble anodes in slabs or baskets has for the most part remained the same. Soluble, phosphorized, copper anodes introduce particulate and limits the ability to control plating distribution.
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
Technical Library | 2024-05-16 16:06:24.0
Much like actual cities where streets and roads connect buildings together, ICs on a board are connected to each other with copper traces. And just like any metropolitan city, urban expansion tends to move vertically instead of horizontally, but instead of multi-story buildings, we get multilayer boards. Vias are copper-plated holes spanning through the different layers of a given board or panel. They are the entrance locations to the subway stations, if you will. Having those multilayer boards has enabled electronic design to minimize the size of boards immensely without compromising on the complexity.
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
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