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Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future Outlook

Technical Library | 2020-03-12 13:10:35.0

The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.

Atotech

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Blackfox Training Institute, LLC
Blackfox Training Institute, LLC

Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.

Training Provider / Standards Setting / Certification / Manufacturer / Consultant / Service Provider

701 Delaware Ave. Unit B
Longmont, CO USA

Phone: 303-684-0135