Technical Library | 2023-04-17 21:25:52.0
Outline/Agenda * Introduction of Ionics and ROSE * Evolution in technology * Rev H in the IPC-J-STD-001 * Real World Case Study * Conclusions
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Technical Library | 1999-05-07 10:11:55.0
The Intel StrataFlashTM memory technology represents a cost breakthrough for flash memory devices by enabling the storage of two bits of data in a single flash memory transistor. This paper will discuss the evolution of the two bit/cell technology from conception to production.
Technical Library | 2010-10-07 20:20:58.0
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin
Technical Library | 2021-02-11 03:07:39.0
Motorized transportation has changed the way we live. Autonomous vehicles are about to do so once more. This evolution of our transport - from horses and carriages, to cars, to driverless vehicles, - has been driven by both technical innovation and socioeconomic factors. In this report we focus on the technological aspect.
Technical Library | 2021-02-11 03:07:58.0
Motorized transportation has changed the way we live. Autonomous vehicles are about to do so once more. This evolution of our transport - from horses and carriages, to cars, to driverless vehicles, - has been driven by both technical innovation and socioeconomic factors. In this report we focus on the technological aspect.
Technical Library | 1999-05-07 08:55:49.0
Failure analysis (FA) is one of the key competencies in Intel. It enables very rapid achievement of world class manufacturing standards, resulting in excellent microprocessor time-to-market performance. This paper discusses the evolution of FA techniques from one generation of microprocessors to another.
Technical Library | 2012-01-19 19:14:49.0
The history of multilayered, three-dimensional monolithic microwave integrated circuit (3-D MMIC) technology is described here. Although significant researches were carried out in the second half of 1990’s, still there were many twists and turns before an
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2017-03-15 22:35:41.0
In 2012, The European Directive on Reduction of Hazardous Substances was recast. The new version of the directive now requires products to be adequately validated as RoHS compliant in order to be eligible for CE marking and access to the EU market (...)This paper starts by reviewing the evolution of the RoHS directive and how it has evolved. It then moves on to cover the requirements and scope of the directive, as well as which standards are used to demonstrate compliance, and how those standards must be referenced in internal company quality processes.
