Technical Library: experience with mousreels (Page 1 of 1)

Unleash Efficiency with Our SMT Flexible Pick and Place Machine

Technical Library | 2023-09-16 07:13:46.0

Experience enhanced flexibility and precision in your assembly line with our state-of-the-art SMT flexible pick and place machine. Optimize production today.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Streamline LED Assembly with Our Fully Automatic SMT Printer

Technical Library | 2023-09-18 03:35:54.0

Experience seamless LED assembly with our state-of-the-art fully automatic SMT printer. Boost efficiency and precision in LED production. Discover our advanced SMT solutions today!

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Achieve Precision and Speed with Our LED High Speed Pick and Place Machine

Technical Library | 2023-09-16 07:08:30.0

Elevate your LED production with our cutting-edge LED high-speed pick and place machine. Experience unmatched precision and efficiency to meet your manufacturing needs.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Optimizing the Wave Soldering Process with Hot Nitrogen Knives

Technical Library | 1999-04-29 15:39:03.0

The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests.

Siemens Process Industries and Drives

Innovation ploughing into the automotive industry with the help of PCB’s

Technical Library | 2016-08-17 01:24:36.0

To stake a claim in upcoming new technologies and increasing improved customer experience, it is now becoming a central point of consideration to bring out the new classy vehicle design, car manufacturing techniques, testing system in the global market. The current vehicle manufacturer’s also aim to maintain equilibrium between deep capital investment and long product cycle to make the car model a success story. With this, the type of printed circuit board to be used in the vehicle is decided with focusing more on the type of material used in the vehicle and the level of electronic manufacturing and design solution needed in the vehicle production. To go into the roots of the automotive industry, it is equally important to get insights into the PCB used in vehicles and the new innovations brought forward by researchers to create a dream vehicle of the series. The below paragraph drives you to the types of PCB used in the automotive sector.

Technotronix

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Technical Library | 2009-01-15 00:42:58.0

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.

Kester

Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive

Technical Library | 2018-07-11 22:46:13.0

For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.

Koki Company LTD

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