Technical Library: expo expo (Page 1 of 5)

IPC Apex Expo 2020 Remarks

Technical Library | 2020-03-12 14:14:07.0

IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success

SMTnet

Scaling LCA with IPC-175x

Technical Library | 2012-06-07 21:44:28.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. IPC-175x Intent: To establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain.

Association Connecting Electronics Industries (IPC)

Voids in Solder Joints

Technical Library | 2019-12-12 21:43:43.0

Presented at SMTA Boise Expo and Tech Forum, March 20, 2018

Intel Corporation

Hot Nitrogen For Wave Soldering

Technical Library | 2012-07-05 06:10:59.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. A new innovation for increasing quality & productivity of wave soldering machines.

Air Liquide

Design and Construction Affects on PWB Reliability

Technical Library | 2012-04-26 18:52:37.0

First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva

PWB Interconnect Solutions Inc.

SMT Manufacturability and Reliability in PCB Cavities

Technical Library | 2012-05-31 18:01:31.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such

AT&S

Environmental Compliance Reporting - Mastering a Moving Target

Technical Library | 2012-05-17 21:53:39.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Companies that have initiated internal resources to obtain compliance data have realized that collecting, and more importantly, maintaining the currency of that data requires more

Total Parts Plus

Minimizing Voiding In QFN Packages Using Solder Preforms

Technical Library | 2012-07-27 11:18:29.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo

Indium Corporation

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Technical Library | 2012-09-13 20:45:17.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor

Agilent Technologies, Inc.

New Developments in PCB Laminates

Technical Library | 2012-07-19 21:24:02.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high

Rogers Corporation

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