Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
Technical Library | 2021-09-15 18:44:20.0
Analyzing failures is a critical process in determining the physical root causes of problems. The process is complex, draws upon many different technical disciplines, and uses a variety of observation, inspection, and laboratory techniques. One of the key factors in properly performing a failure analysis is keeping an open mind while examining and analyzing the evidence to foster a clear, unbiased perspective of the failure.
Technical Library | 2023-03-16 18:57:32.0
Outline * Introduction & Background * Factors Affecting CAF Formation * CAF Formation ** Catastrophic Field Failure of Military Hardware ** Laboratory Experiments * Conclusion
Technical Library | 2020-11-19 20:35:26.0
Simultaneously with the first complex electronic circuits, the task of creating effective means of diagnosing and repairing them appeared. In previous decades, specialized programmable stands were used for diagnostics of serial electronic products, as well as various testers and probes for troubleshooting during their operation. But the dramatic increase in the density / cost factor, in parallel with the very rapid modification of electronic products, made programmable stands economically ineffective even in mass production. The use of traditional laboratory equipment (oscilloscopes, multimeters, etc.) requires power supply to the defective modules, which is often impossible and unsafe, since it can lead to failure of the working modules of the module. In addition, the use of this equipment requires documentation and highly qualified personnel. More automated and sophisticated signature analysis systems came to the rescue in solving this problem. A feature of these devices is that they allow you to test digital and analog assemblies without dismantling components and without supplying voltage.
Technical Library | 2023-01-23 20:50:05.0
PDC Outline Section 0: Intro Section 1: What is reliability and root cause? Section 2: Overview of failure mechanisms Section 3: Failure analysis techniques – Non-destructive analysis techniques – Destructive analysis – Materials characterization Section 4: Summary and closure
Technical Library | 2019-07-30 15:29:50.0
Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50°/75°C, -55°/100°C, and -55°/125°C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.
Technical Library | 2019-12-18 23:28:07.0
Electronic tongue systems equipped with cross-sensitive potentiometric sensors have been applied to pharmaceutical analysis, due to the possibility of various applications and developing new formulations. Many studies already proved the complementarity between the electronic tongue and classical analysis such as dissolution tests indicated by Pharmacopeias. However, as a new approach to study pharmaceuticals, electronic tongues lack strict testing protocols and specification limits; therefore, their results can be improperly interpreted and inconsistent with the reference studies. Therefore, all aspects of the development, measurement conditions, data analysis, and interpretation of electronic tongue results were discussed in this overview. The critical evaluation of the effectiveness and reliability of constructed devices may be helpful for a better understanding of electronic tongue systems development and for providing strict testing protocols.
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