Technical Library | 2020-02-18 09:56:24.0
Glob Top, Dam and Fill & Flit Chip Underfill To protect PCBs from damaging outside influences, they are coated with a thin layer of casting resin or protective finish during the conformal coating process. In addition to sealing the entire circuit board, it is possible to pot only sections or individual components on the substrate. Different methods ranging from "glob top" to "dam and fill" and "flip chip underfill" have been developed for this purpose.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
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