Technical Library | 2012-05-17 21:53:39.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Companies that have initiated internal resources to obtain compliance data have realized that collecting, and more importantly, maintaining the currency of that data requires more
Technical Library | 2012-07-27 11:18:29.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Technical Library | 2019-02-07 02:24:06.0
Antistatic plastic IC shipping tube customization, need to provide the following four aspects of information: First, the choice of pipe material; Second, the size of the parts or physical; Third, the length of the pipe; Fourth, the choice of plug.
Technical Library | 2013-04-12 07:22:40.0
Here Chris talks about the pitfalls, the paucity of safe options for manufacturers seeking rare components, and his exasperation with organisations that appear to shelve common sense at the first sign of a shortage. He shares his ‘no nonsense’ approach to getting things right first time, and explains his thinking in establishing an independent distributor focused exclusively on delivering 100% component integrity.
Technical Library | 2023-07-31 17:35:30.0
The benefits of autonomous vehicles (AVs) are widely acknowledged, but there are concerns about the extent of these benefits and AV risks and unintended consequences. In this article, we first examine AVs and different categories of the technological risks associated with them. We then explore strategies that can be adopted to address these risks, and explore emerging responses by governments for addressing AV risks. Our analyses reveal that, thus far, governments have in most instances avoided stringent measures in order to promote AV developments and the majority of responses are non-binding and focus on creating councils or working groups to better explore AV implications. The US has been active in introducing legislations to address issues related to privacy and cybersecurity. The UK and Germany, in particular, have enacted laws to address liability issues; other countries mostly acknowledge these issues, but have yet to implement specific strategies. To address privacy and cybersecurity risks strategies ranging from introduction or amendment of non-AV specific legislation to creating working groups have been adopted. Much less attention has been paid to issues such as environmental and employment risks, although a few governments have begun programmes to retrain workers who might be negatively affected.
Technical Library | 2012-07-19 21:24:02.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high
Technical Library | 2011-03-17 15:29:54.0
Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high bandwidth, scalable first approximation circuit model using simple transmission lines o
Technical Library | 2012-02-23 21:16:28.0
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro
Technical Library | 2012-05-03 20:40:10.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled, un-powered, vec
