Technical Library: first article insprection (Page 4 of 16)

0201 and 01005 Adoption in Industry

Technical Library | 2011-02-03 17:58:46.0

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu

DfR Solutions

Design and Construction Affects on PWB Reliability

Technical Library | 2012-04-26 18:52:37.0

First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva

PWB Interconnect Solutions Inc.

SMT Manufacturability and Reliability in PCB Cavities

Technical Library | 2012-05-31 18:01:31.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such

AT&S

Why companies prefer to outsource designing of PCBs?

Technical Library | 2013-10-30 00:31:06.0

While putting the product in the final market and on store shelves, it is not wise to go for the first idea. Especially in the electronics industry, there is always a scope of improving a product and making it better, more precise and functional.

American Progressive Circuits,Inc,

Environmental Compliance Reporting - Mastering a Moving Target

Technical Library | 2012-05-17 21:53:39.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Companies that have initiated internal resources to obtain compliance data have realized that collecting, and more importantly, maintaining the currency of that data requires more

Total Parts Plus

Minimizing Voiding In QFN Packages Using Solder Preforms

Technical Library | 2012-07-27 11:18:29.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo

Indium Corporation

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Technical Library | 2012-09-13 20:45:17.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor

Agilent Technologies, Inc.

Anti static IC shipping tube customization guidelines

Technical Library | 2019-02-07 02:24:06.0

Antistatic plastic IC shipping tube customization, need to provide the following four aspects of information: First, the choice of pipe material; Second, the size of the parts or physical; Third, the length of the pipe; Fourth, the choice of plug.

Shenzhen Sewate Technology Co.,Ltd

Be Vigilant: It’s a Jungle Out There

Technical Library | 2013-04-12 07:22:40.0

Here Chris talks about the pitfalls, the paucity of safe options for manufacturers seeking rare components, and his exasperation with organisations that appear to shelve common sense at the first sign of a shortage. He shares his ‘no nonsense’ approach to getting things right first time, and explains his thinking in establishing an independent distributor focused exclusively on delivering 100% component integrity.

Vigilant Components

Governing Autonomous Vehicles: Emerging Responses For Safety, Liability, Privacy, Cybersecurity, And Industry Risks

Technical Library | 2023-07-31 17:35:30.0

The benefits of autonomous vehicles (AVs) are widely acknowledged, but there are concerns about the extent of these benefits and AV risks and unintended consequences. In this article, we first examine AVs and different categories of the technological risks associated with them. We then explore strategies that can be adopted to address these risks, and explore emerging responses by governments for addressing AV risks. Our analyses reveal that, thus far, governments have in most instances avoided stringent measures in order to promote AV developments and the majority of responses are non-binding and focus on creating councils or working groups to better explore AV implications. The US has been active in introducing legislations to address issues related to privacy and cybersecurity. The UK and Germany, in particular, have enacted laws to address liability issues; other countries mostly acknowledge these issues, but have yet to implement specific strategies. To address privacy and cybersecurity risks strategies ranging from introduction or amendment of non-AV specific legislation to creating working groups have been adopted. Much less attention has been paid to issues such as environmental and employment risks, although a few governments have begun programmes to retrain workers who might be negatively affected.

National University of Singapore


first article insprection searches for Companies, Equipment, Machines, Suppliers & Information

Global manufacturing solutions provider

High Precision Fluid Dispensers
Blackfox IPC Training & Certification

Wave Soldering 101 Training Course
SMT feeders

Best Reflow Oven
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals