Technical Library | 2011-06-09 20:28:30.0
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and
Technical Library | 2024-07-24 01:18:03.0
Quad Flat No-Lead (QFN) packages has become very popular in the industry and are widely used in many products. These packages have different size and pin counts, but they have a common feature: thermal pad at the bottom of device. The thermal pad of the leadless QFN provides efficient heat dissipation from the component to PCB. In many cases, arrays of the thermal via under the component is used to dissipate heat from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side.
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
| 1 |
.png)