Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
Technical Library | 2020-07-02 13:29:37.0
Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.
Technical Library | 2020-05-28 02:19:28.0
Properly functioning printed circuit boards are essential for both manufacturers of electronic devices and also the developers if the overall intent is for the electronic device to function at high capacity. From designing the schematics of the printed circuit boards to testing the products, there is no process of PCB manufacturing and/or assembly that can be taken for granted. While it's true that you can attempt this process on your own, especially if you are in possession of a large scale manufacturing facility, here are a few reasons why it would be a better option to opt for a professional company for PCB manufacturing and assembly. 1. Variety A professional printed circuit boards manufacturing company will be able to offer you a huge variety. You will be able to choose from rigid, flexible, or rigid-flex. What's more, the PCBs will be customized as per the need of the application. 2. Quality Professional and good printed circuit board manufacturing and assembling companies might cost you just a little bit extra but they also guarantee to produce the best results and offer very high quality products. In the end, it is quality that will make the difference between mediocre and a high functioning PCB. 3. Cost Efficiency Since you don't have to waste time or resources on buying equipment to produce the best PCBs or hiring staff to oversee the process, you can actually end up saving money. You can even save on PCB assembly cost by hiring this job out. All you have to do is to negotiate the quote and sit back, relax, and wait for the PCBs to be delivered to you. 4. Eliminate Design Flaws Design engineers hired by PCB manufacturing and assembling companies use the best graphic software to develop and test the schematics of PCBs. This increases the chances of eliminating flaws in the printed circuit boards during the initial design phase. 5. Multilayer PCB Manufacturing and Assembly The process of manufacturing and assembling multilayer PCBs is as intricate as it sounds. All processes of manufacturing and assembling multilayer PCBs require the best machines and trained technicians to pass the quality and functionality tests. Manufacturing and assembling multilayer printed circuit boards yourself is going to cost you a lot. Even the smallest of mistakes during the manufacturing and assembling process might render the entire PCB entirely useless. 6. Save Time PCBs are just a single part of the electronic device. To complete the device, many more pieces would be needed. The manufacturers of the electronic device can hire out the job of manufacturing or assembling the PCBs, which will mean they will have one less chore to do. This, in turn, will save you a lot of time which could be spent on elevating the quality of the product. 7. Experience Experience makes all the difference. It is what makes the name of any company reliable in the market. Long experience of manufacturing and assembling printed circuit boards makes the company well versed in the process and it also makes it an expert to identify design, manufacturing, assembling, and testing needs of certain applications We, at Asia Pacific Circuits, offer these benefits and so much more. For quick turn PCB assembly, PCB manufacturing and PCB designing, you can contact us anytime.
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
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