Technical Library: fr4 and htg (Page 1 of 1)

Solder Paste Dispensing For Aerospace and Defense

Technical Library | 2023-08-16 18:16:05.0

A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards.

GPD Global

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Technical Library | 2012-08-23 21:06:35.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res

Albemarle Corporation

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

Technical Library | 2012-09-20 21:45:38.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturin

Agilent Technologies, Inc.

High Performance Multilayer PCBs Design and Manufacturability

Technical Library | 2013-10-31 17:36:41.0

Multilayer printed circuit boards (PCBs) that utilize high performance materials are inherently far more challenging for a fabricator to build, due to significant material property differences over standard epoxy glass FR4. These unique material characteristics often require higher processing temperatures, special surface treatments (to aid in hole and surface plating), they possess different expansion properties, making layer-to-layer registration more difficult to control, and require many other unique considerations.

Spectrum Integrity, Inc.

How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR?

Technical Library | 2016-09-08 16:27:49.0

In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.

Foresite Inc.

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