Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
Technical Library | 2020-12-16 18:50:42.0
System operating speeds continue to increase as a function of the consumer demand for such technologies as faster Internet connectivity, video on demand, and mobile communications technology. As a result, new high performance PCB substrates have emerged to address signal integrity issues at higher operating frequencies. These are commonly called low Dk and/or low loss (Df) materials. The published "typical" values found on a product data sheet provide limited information, usually a single construction and resin content, and are derived from a wide range of test methods and test sample configurations. A printed circuit board designer or front end application engineer must be aware that making a design decision based on the limited information found on a product data sheet can lead to errors which can delay a product launch or increase the assembled PCB cost. The purpose of this paper is to highlight critical selection factors that go beyond a typical product data sheet and explain how these factors must be considered when selecting materials for high speed applications
Technical Library | 2020-02-19 23:12:55.0
Silver nanowires (Ag NWs) possess excellent optoelectronic properties, which have led to many technology-focused applications of transparent and flexible electronics. Many of these applications require patterning of Ag NWs into desired shapes, for which mask-based and printing-based techniques have been developed and widely used. However, there are still several limitations associated to these techniques. These limitations, such as complicated patterning procedures, limited patterning area, and compromised optical transparency, hamper the efficient fabrication of high-performance Ag NW patterns. Here, we propose a coat-and-print approach for effectively patterning Ag NWs.
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Technical Library | 2010-04-15 20:42:44.0
The high level of current interest in embedded passives in printed circuit boards is driven by the tremendous pressure to pack more circuitry into smaller spaces. However, adoption has been limited due to design, prototyping and infrastructure issues, as well as the stability and tolerances necessary for widespread replacement of discretes. The focus of this work has been to develop a polymer thick film resistor technology to incorporate reliable organic resistors inside printed wiring boards using standard PWB processing.
Technical Library | 1999-08-09 11:11:55.0
A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate.
Technical Library | 2013-08-01 13:17:44.0
Electronic industry uses a number of metallic materials in various forms. Also new materials and technology are introduced all the time for increased performance. In recent years, corrosion of electronic systems has been a significant issue. Multiplicity of materials used is one reason limiting the corrosion reliability. However, the reduced spacing between components on a printed circuit board (PCB) due to miniaturization of device is another factor that has made easy for interaction of components in corrosive environments. Presently the knowledge on corrosion issues of electronics is very limited. This paper reviews briefly the materials used in electronic systems, factors influencing corrosion, types of corrosion observed in electronics, and testing methods.
Technical Library | 2012-05-03 20:40:10.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled, un-powered, vec
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Technical Library | 2008-05-07 17:54:58.0
Tracking goods through manufacturing was originally accomplished with pencil, paper and human input. Barcodes introduced an automated, machine-readable tracking mechanism that streamlined all types of manufacturing. But modern printed circuit board (PCB) assemblies are running into limitations because of barcode labels. And though barcodes and RFID tags will co-exist, the relatively large barcode labels have to find increasingly scarce real estate on high density boards.
Technical Library | 2012-10-25 16:34:02.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated.
