Technical Library | 2023-08-14 09:06:53.0
In the operation of SMT mounter, the process and integrity of the nozzle of the mounter will have a significant impact on the performance of the machine. As one of the important components of the SMT machine, it is necessary for us to carry out daily maintenance and upkeep of the SMT nozzle. To ensure that the suction nozzle of the SMT machine is intact before operation, how should we do a good job of maintaining the suction nozzle of the SMT machine during normal use? KINGSUN technical team analysis operation has the following main points: 1.Wipe the surface of the SMT nozzle with a dust-free cloth. 2.The small aperture nozzle can be passed through with a thin steel wire and then blown with an air gun. 3.The surface of the nozzle should not be soaked with corrosive solution such as alcohol, as this may cause the surface to fall off. 4.HOLDER should use a cotton swab to wipe the cavity and not damage the filter screen. 5.Regular addition of special grease to HOLDER claws. 6.According to production, it is best to regularly maintain and do other maintenance regularly. (* Suitable for Yamaha SMT machine nozzles , JUKI SMT machine nozzles, Samsung SMT machine nozzles, Panasonic SMT machine nozzles, Fuji SMT machine nozzles, Siemens SMT machine nozzles etc.) Regarding the SMT machine nozzle daily maintenance operation instructions, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com , thanks.
Technical Library | 2009-11-18 23:37:52.0
Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link.
Technical Library | 2020-07-02 01:14:44.0
Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.
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