Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
Technical Library | 2023-11-14 02:36:41.0
Understanding In-Circuit Testing (ICT) with PCBA ICT Testing Machine In-Circuit Testing, commonly known as ICT, stands as a sophisticated and precise method within electronics manufacturing. It serves to evaluate the functionality and integrity of individual electronic components on a Printed Circuit Board (PCB). The process employs specialized equipment called ICT Testers, meticulously designed to pinpoint defects, shorts, opens, and other potential issues within the PCB assembly. The Crucial Role of PCBA ICT Testing Machine 1. Quality Assurance ICT is pivotal in ensuring the overall quality and reliability of electronic products. Early identification and rectification of defects in the production process help manufacturers avoid costly recalls, rework, and post-production issues. 2. Cost-Efficiency ICT significantly reduces manufacturing costs by identifying defects at an early stage. This results in fewer defective units reaching the end of the production line, minimizing waste and rework. 3. Faster Time-to-Market Manufacturers can expedite the production process with ICT by swiftly identifying and resolving issues. This leads to faster product launches, providing a competitive edge in the market. Unveiling the Functions of PCBA ICT Testing Machine The ICT Tester, the core of the In-Circuit Testing process, conducts a battery of tests on each PCB, including: 1. Continuity Testing Checks for open circuits, ensuring all connections are properly established. 2. Component Verification Verifies the presence and orientation of components, ensuring alignment with the PCB design. 3. Functional Testing Some ICT Testers execute functional tests, assessing electronic components' performance as per specifications. 4. Short Testing Identifies unintended connections or shorts between different components on the PCB. 5. Insulation Testing Checks for isolation between different circuits, ensuring no undesired connections or paths. 6. Programming and Configuration In some cases, ICT Testers are used to program and configure specific components on the PCB. Advantages of PCBA ICT Testing Machine 1. High Precision ICT offers unparalleled accuracy in defect detection, making it crucial in modern electronics manufacturing. 2. Speed and Efficiency ICT Testers enable rapid testing, allowing manufacturers to assess a large number of PCBs in a short time. 3. Customization ICT Tests can be tailored to suit specific PCB requirements, ensuring thorough evaluation of every design aspect. 4. Data Collection ICT Testers gather valuable data for process optimization and quality control. In-Circuit Testing (ICT) is fundamental in electronics manufacturing, safeguarding product quality, reducing costs, and accelerating time-to-market. The ICT Tester, with its precision and efficiency, positions manufacturers at the forefront of the highly competitive electronics industry. Embracing ICT is not just a choice; it's a necessity for manufacturers striving for excellence in their products. I.C.T is a leading manufacturer of full SMT line machines in the electronic manufacturing industry. Discover how we can enhance product quality, boost performance, and reduce costs. Contact us at info@smt11.com for reliable global supply, unparalleled efficiency, and superior technical service.
Technical Library | 2017-02-01 02:20:42.0
BGA Rework Course encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. There should be 'one-stop' solution, that offers a wide range of ball grid array rework and repair services.
Technical Library | 2016-08-18 15:38:09.0
The Selective Reflow Rework Process is an approach to improving the high volume rework process, increasing process capabilities and process repeatability by using a standard reflow oven of 12 zones, pick and place machinery, semi-automated printing gear and Solder Paste Inspection (SPI) implementations. This approach was able to reduce the amount of rework equipment by more than half. Our human resource requirements (indirect and direct labor) were cut by more than 50% and our rolled throughput yield increased from 68.9% to 84.14%. The Selective Reflow Rework Process is less reliant upon operators and has become a repeatable, stable rework process.
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
Technical Library | 2010-03-18 14:02:03.0
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.
Technical Library | 2007-10-18 13:42:45.0
To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains to considerations regarding design, components, PWBs, solder alloys, fluxe s, printing, reflow, wave soldering, rework, cleaning, equipment wear & tear and inspection.
Technical Library | 2016-03-17 19:09:46.0
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the PCB assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework printed circuit boards increases dramatically.Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen printing.
Technical Library | 2016-01-12 11:05:28.0
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield, eliminate the head-in-pillow effect, and enhance rework yield. However, Sn/Bi alloy is not strong enough to replace lead-free (SAC) and eutectic Sn/Pb alloys in most applications. In order to improve the strength of Sn/Bi solder joints, enhance mechanical performance, and improve reliability properties such as thermal cycling performance of soldered electronic devices, YINCAE has developed a low temperature solder joint encapsulant for Sn/Bi soldering applications. This low temperature solder joint encapsulant can be dipped, dispensed, or printed. After reflow with Sn/Bi solder paste or alloy, solder joint encapsulant encapsulates the solder joint. As a result, the strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. All details will be discussed in this paper.
