Technical Library: greg (Page 1 of 3)

An Overview of the Intel TFLOPS Supercomputer

Technical Library | 1999-05-07 09:54:35.0

In this paper, we give an overview of the ASCI Option Red Supercomputer. The motivation for building this supercomputer is presented and the hardware and software views of the machine are described in detail. We also briefly discuss what it is like..

Intel Corporation

Conformal Coating Why, What, When, and How

Technical Library | 2012-01-05 18:40:07.0

Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a membrane between the board and the environment. With this coating in place, the circuit card can withstand more moisture by incre

DfR Solutions (acquired by ANSYS Inc)

The Performance of the Intel TFLOPS Supercomputer

Technical Library | 1999-05-07 09:56:38.0

The purpose of building a supercomputer is to provide superior performance on real applications. In this paper, we describe the performance of the Intel TFLOPS Supercomputer starting at the lowest level with a detailed investigation of the Pentium® Pro processor and the supporting memory subsystem.

Intel Corporation

Intel StrataFlash™ Memory Technology Overview

Technical Library | 1999-05-07 10:11:55.0

The Intel StrataFlashTM memory technology represents a cost breakthrough for flash memory devices by enabling the storage of two bits of data in a single flash memory transistor. This paper will discuss the evolution of the two bit/cell technology from conception to production.

Intel Corporation

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Technical Library | 2011-10-27 18:03:53.0

Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row

DfR Solutions (acquired by ANSYS Inc)

Best Practices for Improving the PCB Supply Chain: Performing the Process Audit

Technical Library | 2018-08-03 14:37:59.0

In the electronics industry, the quality and reliability of any product is highly dependent upon the capabilities of the manufacturing suppliers. Manufacturing defects are one of the top reasons why companies fail to meet warranty expectations. These problems can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Supplier selection also plays a critical role in the success or failure of the final product.

DfR Solutions (acquired by ANSYS Inc)

Temperature Cycling and Fatigue in Electronics

Technical Library | 2020-01-01 17:06:52.0

The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.

DfR Solutions (acquired by ANSYS Inc)

iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes

Technical Library | 2021-05-13 16:09:02.0

The 2017 iNEMI Board and Assembly Roadmap forecasts that, due to economic, environmental and technical drivers, use of low temperature solder pastes will increase significantly and reach 10% of all solder paste used for board assembly by 2021.

iNEMI (International Electronics Manufacturing Initiative)

Coatings and Pottings: A Critical Update

Technical Library | 2021-08-11 01:00:37.0

Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.

DfR Solutions (acquired by ANSYS Inc)

Counterfeit Detection Strategies: When to Do It / How to Do It

Technical Library | 2021-10-12 18:08:28.0

Counterfeit components have been defined as a growing concern in recent years as demand increases for reducing costs. In fact the Department of Commerce has identified a 141% increase in the last three years alone. A counterfeit is any item that is not as it is represented with the intention to deceive its buyer or user. The misrepresentation is often driven by the known presence of defects or other inadequacies in regards to performance. Whether it is used for a commercial, medical or military application, a counterfeit component could cause catastrophic failure at a critical moment.

DfR Solutions (acquired by ANSYS Inc)

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