Technical Library | 2012-02-02 19:09:53.0
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S
The Foundation for Scientific and Industrial Research - SINTEF
Technical Library | 2008-11-27 01:25:25.0
Military electrical connectors have traditionally used very conservative design rules that provide the ruggedization needed for harsh military use environments. Commercial electronic connectors have typically used less conservative design rules that.
Technical Library | 2012-08-09 20:33:45.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field failures and huge losses, which annually total several bi
Technical Library | 2015-07-31 16:28:16.0
Technology is in constant change and circuit assembly is no different. It is becoming more and more advanced as needs change and demands for more capabilities increase. In order to meet these demands, equipment manufacturers are integrating the latest innovations and tools to serve the industry. The need to better protect printed circuit assemblies from harsh environments using automated selective conformal coating is becoming a must. 5 axis fluid dispensing allows conformal coating to be applied to printed circuit assemblies like never before.
Technical Library | 2016-02-18 18:55:09.0
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability.
Technical Library | 2022-03-16 19:41:17.0
Creep corrosion occurs in electronics assemblies and it is reminiscent to electromigration but does not require electrical field to drive the reaction. Corrosive elements and moisture must be present for creep corrosion to occur. Sulfur is the most prominent element to cause creep corrosion in environments such as paper mills, rubber manufacturing, mining, cement manufacturing, waste water treatment etc., also including companies and locations nearby such industries. The main part of printed circuit board assembly (PCBA) to be affected is the PCB surface finish. Especially immersion silver is prone to creep corrosion, but it sometimes occurs in NiPd (lead frames), and to a lesser extent in ENIG and OSP surface finishes. As the use of immersion silver is increasing as PCB surface finish and electronics are more and more used in harsh environments, creep corrosion is a growing risk. In this paper we will present the driving forces and mechanisms as well as suitable tests and mitigation strategies against creep corrosion
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Technical Library | 2013-04-18 16:46:42.0
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: to protect from moisture and contamination, to minimize dendritic growth, to provide stress relief, and for insulation resistance. These contribute to more durable handling, enhanced device reliability, and reduced warranty costs. Increased miniaturization of new circuit board designs requires flexible, low stress coating material to protect delicate components and fine-pitch leads. Silicone conformal coatings offer many advantages that address the general trend of ongoing PCBs designs, such as: high flexibility and low modulus to reduce stress on delicate or small components... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
Technical Library | 2021-12-17 01:30:28.0
Diffusion silicon pressure transmitter is applied in a wide variety of industries, such as petroleum, chemical industry, steel, power, light industry and environmental protection industry. It can complete the work of measurement and control of the gauge pressure, negative pressure or absolute pressure of various fluid pressure. Most importantly, this type of transmitter can be used in corrosive medium and harsh or dangerous environment. In the process of using the transmitter, there may be some faults or problems.
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